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|1. (WO2018083982) DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP|
|Title:||DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP|
This dicing die bonding sheet is provided with: a base material; an adhesive layer that is formed on the base material; an intermediate layer that is formed on the adhesive layer; and a film-like bonding agent that is formed on the intermediate layer. The intermediate layer is formed from a resin; an interface of the intermediate layer, on which the film-like bonding agent is provided, has been subjected to a releasing treatment; and the intermediate layer has a tensile modulus of elasticity of 3,500 MPa or more.