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1. (WO2018083982) DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP

Pub. No.:    WO/2018/083982    International Application No.:    PCT/JP2017/037663
Publication Date: Sat May 12 01:59:59 CEST 2018 International Filing Date: Thu Oct 19 01:59:59 CEST 2017
IPC: H01L 21/301
C09J 7/02
C09J 201/00
H01L 21/52
Applicants: LINTEC CORPORATION
リンテック株式会社
Inventors: TSUCHIYAMA Sayaka
土山 さやか
SUZUKI Hideaki
鈴木 英明
SATO Akinori
佐藤 明徳
Title: DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP
Abstract:
This dicing die bonding sheet is provided with: a base material; an adhesive layer that is formed on the base material; an intermediate layer that is formed on the adhesive layer; and a film-like bonding agent that is formed on the intermediate layer. The intermediate layer is formed from a resin; an interface of the intermediate layer, on which the film-like bonding agent is provided, has been subjected to a releasing treatment; and the intermediate layer has a tensile modulus of elasticity of 3,500 MPa or more.