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1. (WO2018083904) SEMICONDUCTOR DEVICE INSPECTION APPARATUS AND SEMICONDUCTOR DEVICE INSPECTION METHOD

Pub. No.:    WO/2018/083904    International Application No.:    PCT/JP2017/033944
Publication Date: Sat May 12 01:59:59 CEST 2018 International Filing Date: Thu Sep 21 01:59:59 CEST 2017
IPC: G01R 31/302
G01R 31/26
Applicants: HAMAMATSU PHOTONICS K.K.
浜松ホトニクス株式会社
Inventors: MATSUMOTO Toru
松本 徹
SHIMASE Akira
嶋瀬 朗
Title: SEMICONDUCTOR DEVICE INSPECTION APPARATUS AND SEMICONDUCTOR DEVICE INSPECTION METHOD
Abstract:
This semiconductor device inspection apparatus inspects a semiconductor device to be inspected on the basis of a result signal outputted in accordance with the input of a test pattern signal to the semiconductor device, and comprises: an ultrasonic transducer which is arranged opposite to the semiconductor device and which generates ultrasonic waves; a stage which moves the relative position of the semiconductor device and the ultrasonic transducer; a stimulation condition control unit which controls a condition of stimulation by the ultrasonic waves applied to the semiconductor device; and an analysis unit which generates a measurement image on the basis of the result signal outputted from the semiconductor device.