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1. (WO2018083885) EPOXY RESIN COMPOSITION AND STRUCTURE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/083885 International Application No.: PCT/JP2017/032806
Publication Date: 11.05.2018 International Filing Date: 12.09.2017
IPC:
C08L 63/00 (2006.01) ,C08G 59/62 (2006.01) ,C08K 3/00 (2006.01) ,C08K 5/13 (2006.01) ,C08K 5/3445 (2006.01) ,C08K 7/18 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
62
Alcohols or phenols
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
04
Oxygen-containing compounds
13
Phenols; Phenolates
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
16
Nitrogen-containing compounds
34
Heterocyclic compounds having nitrogen in the ring
3442
having two nitrogen atoms in the ring
3445
Five-membered rings
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
16
Solid spheres
18
inorganic
Applicants:
住友ベークライト株式会社 SUMITOMO BAKELITE CO., LTD. [JP/JP]; 東京都品川区東品川2丁目5番8号 5-8, Higashi-Shinagawa 2-chome, Shinagawa-ku, Tokyo 1400002, JP
Inventors:
前田 重之 MAEDA Shigeyuki; JP
Agent:
速水 進治 HAYAMI Shinji; JP
Priority Data:
2016-21489002.11.2016JP
Title (EN) EPOXY RESIN COMPOSITION AND STRUCTURE
(FR) COMPOSITION ET STRUCTURE DE RÉSINE ÉPOXYDE
(JA) エポキシ樹脂組成物および構造体
Abstract:
(EN) The epoxy resin composition according to the present invention comprises an epoxy resin, a hardener, an inorganic filler, and a hardening accelerator. When heated from 30°C to 200°C under the conditions of a heating rate of 10 °C/min using a differential scanning calorimeter, the epoxy resin composition gives a DSC curve which has a maximum exothermic-peak temperature of 80-145°C.
(FR) La composition de résine époxyde selon la présente invention comprend une résine époxyde, un durcisseur, une charge inorganique et un accélérateur de durcissement. Lorsqu'elle est chauffée de 30 °C à 200 °C dans les conditions d'une vitesse de chauffage de 10 °C/min à l'aide d'un calorimètre différentiel à balayage, la composition de résine époxyde donne une courbe d'analyse calorimétrique différentielle à balayage qui présente une température maximale de pic exothermique allant de 80 à 145 °C.
(JA) 本発明のエポキシ樹脂組成物は、エポキシ樹脂と、硬化剤と、無機充填材と、硬化促進剤と、を含むものであって、示差走査熱量計を用いて昇温速度10℃/分の条件下で30℃から200℃まで昇温した際に得られる当該エポキシ樹脂組成物のDSC曲線における最大発熱ピーク温度が80℃以上145℃以下である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)