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1. (WO2018083832) CURABLE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR DEVICE
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Pub. No.: WO/2018/083832 International Application No.: PCT/JP2017/022176
Publication Date: 11.05.2018 International Filing Date: 15.06.2017
IPC:
C08L 83/07 (2006.01) ,C08K 5/07 (2006.01) ,C08L 83/05 (2006.01) ,C09K 3/10 (2006.01) ,G02B 1/04 (2006.01) ,H01L 23/29 (2006.01) ,H01L 23/31 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
07
containing silicon bound to unsaturated aliphatic groups
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
04
Oxygen-containing compounds
07
Aldehydes; Ketones
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04
Polysiloxanes
05
containing silicon bound to hydrogen
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
10
for sealing or packing joints or covers
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
1
Optical elements characterised by the material of which they are made; Optical coatings for optical elements
04
made of organic materials, e.g. plastics
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
29
characterised by the material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
28
Encapsulation, e.g. encapsulating layers, coatings
31
characterised by the arrangement
Applicants:
株式会社ダイセル DAICEL CORPORATION [JP/JP]; 大阪府大阪市北区大深町3番1号 3-1, Ofuka-cho, Kita-ku, Osaka-shi, Osaka 5300011, JP
Inventors:
中川泰伸 NAKAGAWA, Yasunobu; JP
Agent:
特許業務法人後藤特許事務所 GOTO & CO.; 大阪府大阪市北区紅梅町2番18号 2-18, Kobai-cho, Kita-ku, Osaka-shi, Osaka 5300038, JP
Priority Data:
2016-21473902.11.2016JP
Title (EN) CURABLE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DE RÉSINE DURCISSABLE, PRODUIT DURCI ET DISPOSITIF SEMI-CONDUCTEUR
(JA) 硬化性樹脂組成物、硬化物、及び半導体装置
Abstract:
(EN) The present invention provides a curable resin composition which has good solubility to silicone resin with no precipitation even when the addition of a rare earth compound is increased and which, when cured, is capable of forming a cured product that has good transparency and excellent heat resistance and is such that an increase in rigidity and embrittlement is inhibited, in particular, under a high temperature condition of about 250°C. This curable resin composition comprises: a polysiloxane (A) which is at least one selected from the group consisting of a polyorganosiloxane (A1) having two or more alkenyl groups in molecules thereof and a polyorganosiloxy silalkylene (A2) having two or more alkenyl groups in molecules thereof; a polysiloxane (B) which is at least one selected from the group consisting of a polyorganosiloxane (B1) having two or more hydrosilyl groups in molecules thereof and a polyorganosiloxy silalkylene (B2) having two or more hydrosilyl groups in molecules thereof; and a rare earth compound (C) represented by formula (1). The content of rare earth metal atoms relative to the total amount of the curable resin composition is 30 to 500 ppm. The rare earth compound (C) represented by formula (1) is as described in the description.
(FR) La présente invention concerne une composition de résine durcissable qui présente une bonne solubilité dans une résine de silicone sans précipitation, même lorsque l'addition d'un composé de terre rare est augmentée et qui, lorsqu'elle est durcie, peut former un produit durci qui présente une bonne transparence et une excellente résistance à la chaleur et est telle qu'une augmentation de rigidité et de fragilisation est inhibée, en particulier, dans des conditions de température élevée d'environ 250°C. Cette composition de résine durcissable comprend : un polysiloxane (A) qui est au moins l'un choisi dans le groupe constitué par un polyorganosiloxane (A1) présentant deux groupes alcényle ou plus dans des molécules correspondantes et un polyorganosiloxysilalkylène (A2) présentant deux groupes alcényle ou plus dans des molécules correspondantes ; un polysiloxane (B) qui est au moins l'un choisi dans le groupe constitué par un polyorganosiloxane (B1) présentant deux groupes hydrosilyle ou plus dans des molécules correspondantes et un polyorganosiloxysilalkylène (B2) présentant au moins deux groupes hydrosilyle dans des molécules correspondantes ; et un composé de terre rare (C) représenté par la formule (1). La teneur en atomes de métal de terre rare par rapport à la quantité totale de la composition de résine durcissable est de 30 à 500 ppm. Le composé de terre rare (C) représenté par la formule (1) est tel que décrit dans la description.
(JA) 本発明は、希土類化合物の添加量を増やしてもシリコーン樹脂への溶解性が良く、析出せず、硬化させることにより、透明性が良く、耐熱性に優れ、特に250℃程度の高温条件下でも硬度の上昇や脆化が抑えられ、硬化物を形成できる硬化性樹脂組成物を提供する。 本発明の硬化性樹脂組成物は、分子内に2個以上のアルケニル基を有するポリオルガノシロキサン(A1)及び分子内に2個以上のアルケニル基を有するポリオルガノシロキシシルアルキレン(A2)からなる群より選択される少なくとも1種であるポリシロキサン(A)と、分子内に2個以上のヒドロシリル基を有するポリオルガノシロキサン(B1)及び分子内に2個以上のヒドロシリル基を有するポリオルガノシロキシシルアルキレン(B2)からなる群より選択される少なくとも1種であるポリシロキサン(B)と、式(1)で表される希土類化合物(C)を含み、硬化性樹脂組成物全量に対する希土類金属原子の含有量が30~500ppmである。なお、前記式(1)で表される希土類化合物(C)は、明細書に記載のとおりである。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)