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1. (WO2018082100) MICRO-LED TRANSFER METHOD AND MANUFACTURING METHOD
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/082100 International Application No.: PCT/CN2016/104926
Publication Date: 11.05.2018 International Filing Date: 07.11.2016
IPC:
H01L 33/36 (2010.01)
Applicants: GOERTEK. INC[CN/CN]; 268 Dongfang Road Hi-Tech Industry District Weifang, Shandong 261031, CN
Inventors: ZOU, Quanbo; CN
Agent: BEYOND TALENT PATENT AGENT FIRM; Room 1202, Kuntai Building #10 Chaoyangmenwai Str., Chaoyang District Beijing 100020, CN
Priority Data:
Title (EN) MICRO-LED TRANSFER METHOD AND MANUFACTURING METHOD
(FR) PROCÉDÉ DE TRANSFERT DE MICRO-DEL ET PROCÉDÉ DE FABRICATION
Abstract: front page image
(EN) A micro-LED transfer method and manufacturing method. The micro-LED (303) transfer method comprises: bringing pickup units (305) of a transfer head in contact with micro-LEDs (303) on a carrier substrate (301), wherein the pickup units (305) are able to apply current to the micro-LEDs (303); applying current to the micro-LEDs (303) via the pickup units (305) to heat up bonding layers (302) between the micro-LEDs (303) and the carrier substrate (301) to be melted; picking up the micro-LEDs (303) from the carrier substrate (301) with the transfer head; bonding the micro-LEDs (303) onto a receiving substrate (307); and removing the transfer head from the micro-LEDs.
(FR) L'invention concerne un procédé de transfert de micro-DEL et un procédé de fabrication. Le procédé de transfert de micro-DEL (303) consiste à : amener des unités ramasseuses (305) d'une tête de transfert en contact avec des micro-DEL (303) sur un substrat porteur (301), les unités ramasseuses (305) étant aptes à appliquer un courant aux micro-DEL (303); appliquer un courant aux micro-DEL (303) par l'intermédiaire des unités ramasseuses (305) pour chauffer les couches de liaison (302) entre les micro-DEL (303) et le substrat porteur (301) afin de les faire fondre; ramasser les micro-DEL (303) à partir du substrat porteur (301) à l'aide de la tête de transfert; lier les micro-DEL (303) sur un substrat de réception (307); et retirer la tête de transfert des micro-DEL.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)