A metal core thermoelectric device and a method of manufacturing such a device are provided herein. In some embodiments, a thermoelectric heat exchanger component includes a metal core circuit board and thermoelectric legs that are attached to the metal core circuit board. A top header is attached to the thermoelectric legs opposite the metal core circuit board. A top heat spreading lid is thermally connected to the top header. In this way, the thermoelectric heat exchanger component does not need the bottom header, bottom side thermal interface material, bottom side attach material, and/or bottom heat spreading lid. This may result in a significant reduction in materials and/or the processing steps required to create the thermoelectric heat exchanger component being greatly simplified. In some embodiments, at least some steps of the manufacturing may use standard surface mount technology equipment.