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1. (WO2018081710) FLEXIBLE PRINTED CIRCUIT TO MITIGATE CRACKING AT THROUGH-HOLES

Pub. No.:    WO/2018/081710    International Application No.:    PCT/US2017/059043
Publication Date: Fri May 04 01:59:59 CEST 2018 International Filing Date: Tue Oct 31 00:59:59 CET 2017
IPC: H05K 1/11
H05K 1/02
Applicants: COMMSCOPE, INC. OF NORTH CAROLINA
Inventors: FITZPATRICK, Brian J.
COOK, Jeffrey
HANSALIA, Jitendra
HASHIM, Amid Ihsan
Title: FLEXIBLE PRINTED CIRCUIT TO MITIGATE CRACKING AT THROUGH-HOLES
Abstract:
Flexible fingers for flexible printed circuits improve the crack resistance of prior art designs. The crack resistance can be improved by encapsulating the trace inside additional layers such that the outer two layers include only the lands of the through-hole, and all other copper is etched away. The crack resistance can also be improved with strategically adding copper on layers other than the trace layer including attaching is to the land of the through-hole as a stub. These two designs can be combined to include a stub trace into a four-layered design.