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1. (WO2018081407) HIGH-LOADING-LEVEL COMPOSITES FOR ELECTROMAGNETIC INTERFERENCE (EMI) APPLICATIONS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/081407 International Application No.: PCT/US2017/058504
Publication Date: 03.05.2018 International Filing Date: 26.10.2017
IPC:
H05K 9/00 (2006.01)
Applicants: 3M INNOVATIVE PROPERTIES COMPANY[US/US]; 3M Center Post Office Box 33427 Saint Paul, Minnesota 55133-3427, US
Inventors: WEST, Don V.; US
LINDSAY, Craig W.; US
ISAACSON, Daniel E.; US
FREY, Matthew H.; US
Agent: DONG, Yufeng; US
RHODES, Kevin H.; US
BLANK, Colene H.,; US
HARTS, Dean M. ,; US
LEVINSON, Eric D.,; US
MAKI, Eloise J.,; US
NOWAK, Sandra K.,; US
OLSON, Peter L.,; US
RINGSRED, Ted K.,; US
Priority Data:
62/415,02231.10.2016US
Title (EN) HIGH-LOADING-LEVEL COMPOSITES FOR ELECTROMAGNETIC INTERFERENCE (EMI) APPLICATIONS
(FR) COMPOSITES À HAUT NIVEAU DE CHARGE POUR DES APPLICATIONS D'INTERFÉRENCE ÉLECTROMAGNÉTIQUE (EMI)
Abstract: front page image
(EN) Electromagnetic interference (EMI) shielding composites with high-loading-level ceramic beads and methods of making and using the same are described. The composites include high-loading-level of ceramic beads distributed inside a polymer matrix. The ceramic beads have a substantially spherical shape. The ceramic beads are formed by melting ceramic powders or particles. In some cases, the ceramic beads include ferrite beads.
(FR) L'invention concerne des composites de blindage contre une interférence électromagnétique (EMI) à billes de céramique à haut niveau de charge et leurs procédés de fabrication et d'utilisation. Les composites comprennent un haut niveau de charge de billes de céramique réparties à l'intérieur d'une matrice polymère. Les billes de céramique ont une forme sensiblement sphérique. Les billes de céramique sont formées par fusion de poudres ou de particules de céramique. Dans certains cas, les billes de céramique comprennent des billes de ferrite.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)