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1. (WO2018081146) BEAMFORMING INTEGRATED CIRCUIT WITH RF GROUNDED MATERIAL RING AND INTEGRAL THERMAL MASS
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Pub. No.: WO/2018/081146 International Application No.: PCT/US2017/058117
Publication Date: 03.05.2018 International Filing Date: 24.10.2017
IPC:
H01Q 1/22 (2006.01) ,H01L 23/043 (2006.01) ,H01L 23/00 (2006.01) ,H01L 21/06 (2006.01) ,H01Q 3/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
1
Details of, or arrangements associated with, aerials
12
Supports; Mounting means
22
by structural association with other equipment or articles
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
04
characterised by the shape
043
the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
06
the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
3
Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an aerial or aerial system
Applicants:
ANOKIWAVE, INC. [US/US]; 11236 El Camino Real Suite 100 San Diego, CA 92130, US
Inventors:
JAIN, Vipul; US
KINAYMAN, Noyan; US
MCMORROW, Robert J.; US
MADSEN, Kristian N.; US
NAHAR, Shamsun; US
JAIN, Nitin; US
Agent:
SUNSTEIN, Bruce D.; US
MURPHY, Timothy, M.; US
SAUNDERS, Steven, G.; US
ASHER, Robert, M.; US
PETUCHOWSKI, Samuel, J.; US
Priority Data:
62/412,12224.10.2016US
Title (EN) BEAMFORMING INTEGRATED CIRCUIT WITH RF GROUNDED MATERIAL RING AND INTEGRAL THERMAL MASS
(FR) CIRCUIT INTÉGRÉ DE FORMATION DE FAISCEAU COMPRENANT UN ANNEAU DE MATÉRIAU MIS À LA MASSE RF ET UNE MASSE THERMIQUE INTÉGRÉE
Abstract:
(EN) A beamforming integrated circuit system for use in a phased array has a microchip with RF circuitry, and a plurality of (on chip) interfaces electrically connected with the RF circuitry. The plurality of interfaces includes a signal interface, a first ground interface, and a second ground interface. The signal interface is configured to communicate an RF signal, and both the first and second ground interfaces are adjacent to the signal interface. The system also has a material ring circumscribing the plurality of interfaces, and at least one RF ground path coupled with the material ring.
(FR) Selon la présente invention, un système de circuit intégré de formation de faisceau destiné à être utilisé dans un réseau à commande de phase comprend une micropuce dotée de circuits RF, et une pluralité d'interfaces (sur puce) électriquement connectées aux circuits RF. La pluralité d'interfaces comprend une interface de signal, une première interface de masse et une seconde interface de masse. L'interface de signal est configurée pour communiquer un signal RF, et les première et seconde interfaces de masse sont adjacentes à l'interface de signal. Le système comprend également un anneau de matériau entourant la pluralité d'interfaces, et au moins un trajet de masse RF couplé à l'anneau de matériau.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)