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1. (WO2018080801) INVERTER

Pub. No.:    WO/2018/080801    International Application No.:    PCT/US2017/056329
Publication Date: Fri May 04 01:59:59 CEST 2018 International Filing Date: Fri Oct 13 01:59:59 CEST 2017
IPC: H01L 23/373
H01L 23/367
H01L 21/58
H01L 21/67
H01L 25/07
H01L 29/78
H01L 29/739
Applicants: TESLA, INC.
Inventors: LIU, Wenjun
RAMM, Robert James
TEPE, Alan David
CAMPBELL, Colin Kenneth
A transistor package comprising: a substrate; a first transistor in thermal contact with the substrate, wherein the transistor comprises a gate; the substrate sintered to a heat sink through a sintered layer; an encapsulant that at least partially encapsulates the first transistor; and a Kelvin connection to the transistor gate.