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1. (WO2018080676) FLOATING PACKAGE STIFFENER

Pub. No.:    WO/2018/080676    International Application No.:    PCT/US2017/052792
Publication Date: Fri May 04 01:59:59 CEST 2018 International Filing Date: Fri Sep 22 01:59:59 CEST 2017
IPC: H01L 23/12
H01L 23/48
H01L 23/485
H01L 23/00
Applicants: INTEL CORPORATION
Inventors: HSU, Hao-Han
HO, Ying Ern
LEE, Jaejin
Title: FLOATING PACKAGE STIFFENER
Abstract:
Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesive adjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodiments may be described and/or claimed.