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1. (WO2018080659) CARBON VEIL HEATER AND METHOD OF MAKING
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CLAIMS

We claim:

1) A heater comprising:

a. a resistive substrate that produces heat upon an application of power;

b. a substrate adhesive including a portion that extends into the resistive substrate and a portion that extends from one or more sides of the resistive substrate so that one side of the resistive substrate is free of the substrate adhesive and one or more sides is covered by a layer of the substrate adhesive;

c. one or more power application portions connected to the resistive substrate on the side of the resistive substrate that is free of the substrate adhesive;

d. one or more attachment devices that connect the one or more power application portions to the resistive substrate;

e. a closing layer including:

i. a closing backing and

ii. a backing adhesive that includes a portion that extends into the closing

backing and a portion that extends from one or more sides of the closing backing so that one side of the closing backing is free of the backing adhesive and one or more sides is covered by a layer of the backing adhesive; and wherein the closing layer extends over the one or more power application portions so that the backing adhesive covers the one or more power application portions, and

wherein the substrate adhesive and the backing adhesive extend together to form a single layer of adhesive.

2) The heater of claim 1 , wherein the substrate adhesive, the backing adhesive, or both extend beyond one or more edges of the resistive substrate, one or more edges of the closing backing, or both respectively so that the substrate adhesive, the backing adhesive, or both form a partial peripheral edge or a full peripheral edge around the resistive substrate, the closing backing, or both respectively.

3) The heater of any of the preceding claims, wherein the substrate adhesive, the backing adhesive, or both extend beyond the one or more sides of the resistive substrate, the closing backing, or both respectively so that a thickness of the resistive substrate and substrate adhesive is greater than the thickness of only the resistive substrate and a thickness of the closing backing, the backing adhesive is greater than the thickness of only the closing backing, or both.

4) The heater of any of the preceding claims, wherein the attachment devices are sewing that penetrates and is connected to the resistive substrate, the substrate adhesive, or both.

5) The heater of any of the preceding claims, wherein a backing is connected to the one or more sides of the resistive substrate with a substrate adhesive and the one or more attachment devices extend through the resistive substrate, the substrate adhesive, and the backing.

6) The heater of any of the preceding claims, wherein the resistive substrate includes a hole and a thermistor extends into the hole to monitor conditions of the heater.

7) The heater of any of the preceding claims, wherein the one or more power application portions include:

a. one or more wires extending from the one or more power application portions that are connected to one or more conductors via one or more electrical connectors and the one or more wires, the electrical connectors, and the one or more power application portions are located on a surface of the resistive substrate;

b. one or more carbon nanotube yarns that are connected on the surface of the resistive substrate and connected to one or more conductors;

c. one or more graphite strips that are connected on the surface of the resistive substrate and connected to the one or more conductors; or

d. a combination of (a), (b), and (c).

8) The heater of claim 7, wherein a patch extends over the connection between the one or more power application portions and the one or more conductors, and the heater is free of a pocket that receives the connection between the one or more power application portions and the one or more conductors.

9) The heater of any of the preceding claims, wherein the resistive substrate and the substrate adhesive are slit into a plurality of strips after the substrate adhesive penetrates into the resistive substrate.

10) The heater of claim 9, wherein the plurality of strips are connected to a backing so that a gap is located between each of the plurality of strips.

11 ) The heater of claim 10, wherein one or more power application portions are connected to each of the plurality of strips and the one or more power application portions extend over the gaps to connect each of the plurality of strips.

12) A heater comprising:

a. a resistive substrate that produces heat upon an application of power;

b. one or more power application portions connected to the resistive substrate; c. one or more attachment devices that connect the one or more power application portions to the resistive substrate;

d. a closing layer including:

i. a closing backing;

ii. a backing adhesive that extends over the one or more power application portions and connects the closing layer to the resistive substrate and the one or more power application portions;

iii. one or more holes that extend through the closing layer so that a portion of the resistive substrate is exposed through the hole; and e. a thermistor;

wherein the thermistor, the one or more power application portions, or both extend through the one or more holes in the closing layer.

13) The heater of claim 12, wherein the thermistor extends through one of the one or more holes and proximate to or into contact with the resistive substrate so that the thermistor monitors a temperature of the heater.

14) The heater of claim 12 or claim 13, wherein wires that connect to the one or more power application portions and the thermistor are located on an external side of the heater.

15) The heater of any of claims 12 through 14, wherein the one or more power application portions extend through the one or more holes so that a portion of the one or more power application portions is located on an external side of the heater.

16) A method comprising:

a. applying a substrate adhesive to a resistive substrate that produces heat upon an application of power, and

b. preventing the substrate adhesive from fully penetrating through the resistive substrate so that the resistive substrate includes a side with the substrate adhesive and a side that is free of the substrate adhesive,

c. applying one or more power application portions over the side of the resistive substrate that is free of the substrate adhesive;

d. applying a closing layer over the one or more power application portions, the closing layer including:

i. a closing backing and

ii. a backing adhesive that includes a portion that extends into the closing

backing and a portion that extends from one or more sides of the closing backing so that one side of the closing backing is free of the backing adhesive and one or more sides is covered by a layer of the backing adhesive;

e. laminating the closing layer and the resistive substrate so that the backing adhesive and the substrate adhesive connect and form one contiguous layer.

17) The method of claim 16, wherein the method includes a step of slitting the substrate adhesive and resistive substrate, after the substrate adhesive is applied to the resistive substrate, so that a plurality of strips are formed, and the method includes a step of laminating the plurality of strips to a backing so that gaps are located between each of the plurality of strips.

18) The method of claim 16 or claim 17, wherein the method includes a step of connecting one or more power application portions to the resistive substrate and extending the one or more power application portions over the gaps.

19) The method of any of claims 16 through 18, wherein the method includes a step of creating a hole in the closing layer and placing a thermistor in the hole.

20) The method of any of claims 16 through 19, wherein the backing and a backing layer are sealed so that a peripheral edge is formed around the resistive substrate, the thermistor, and the one or more power application portions.