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1. (WO2018080224) SEMICONDUCTOR DEVICE PACKAGE

Pub. No.:    WO/2018/080224    International Application No.:    PCT/KR2017/011979
Publication Date: Fri May 04 01:59:59 CEST 2018 International Filing Date: Sat Oct 28 01:59:59 CEST 2017
IPC: H01L 33/48
H01L 33/62
H01L 33/10
H01L 33/58
H01L 33/50
Applicants: LG INNOTEK CO., LTD.
엘지이노텍 주식회사
Inventors: KONG, Sung Min
공성민
Title: SEMICONDUCTOR DEVICE PACKAGE
Abstract:
Disclosed is a semiconductor device package according to an embodiment, the semiconductor comprising: a substrate; first and second lead frames arranged on the substrate; a light emitting element electrically connected to the first and second lead frames; a reflective layer arranged on the substrate so as to reflect the light emitted from the light emitting element; and a lens arranged on the substrate so as to cover the light emitting element, the reflective layer, and the first and second lead frames.