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|1. (WO2018080125) INSULATION LAYER MANUFACTURING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD|
|Applicants:||LG CHEM, LTD.
|Inventors:||JEONG, Woo Jae
KYUNG, You Jin
CHOI, Byung Ju
CHOI, Bo Yun
LEE, Kwang Joo
JEONG, Min Su
|Title:||INSULATION LAYER MANUFACTURING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD|
The present invention relates to an insulation layer manufacturing method according to which the efficiency of the process may be improved since manufacturing is achieved by a quicker and easier method, the physical damage to an insulation layer may be prevented, and it is easy to control the thickness, and to a multilayer printed circuit board manufacturing method using an insulation layer obtained by the said insulation layer manufacturing method.