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1. (WO2018080125) INSULATION LAYER MANUFACTURING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD

Pub. No.:    WO/2018/080125    International Application No.:    PCT/KR2017/011739
Publication Date: Fri May 04 01:59:59 CEST 2018 International Filing Date: Tue Oct 24 01:59:59 CEST 2017
IPC: H05K 3/46
H05K 1/03
C08L 79/08
C08K 3/00
Applicants: LG CHEM, LTD.
주식회사 엘지화학
Inventors: JEONG, Woo Jae
정우재
KYUNG, You Jin
경유진
CHOI, Byung Ju
최병주
CHOI, Bo Yun
최보윤
LEE, Kwang Joo
이광주
JEONG, Min Su
정민수
Title: INSULATION LAYER MANUFACTURING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD
Abstract:
The present invention relates to an insulation layer manufacturing method according to which the efficiency of the process may be improved since manufacturing is achieved by a quicker and easier method, the physical damage to an insulation layer may be prevented, and it is easy to control the thickness, and to a multilayer printed circuit board manufacturing method using an insulation layer obtained by the said insulation layer manufacturing method.