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1. (WO2018080027) FLEXIBLE THERMOELECTRIC MODULE AND THERMOELECTRIC APPARATUS COMPRISING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/080027 International Application No.: PCT/KR2017/010428
Publication Date: 03.05.2018 International Filing Date: 22.09.2017
IPC:
G06F 3/01 (2006.01) ,C09K 5/06 (2006.01) ,H01L 35/32 (2006.01) ,H01L 35/04 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
5
Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
02
Materials undergoing a change of physical state when used
06
the change of state being from liquid to solid or vice-versa
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28
operating with Peltier or Seebeck effect only
32
characterised by the structure or configuration of the cell or thermo-couple forming the device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
04
Structural details of the junction; Connections of leads
Applicants:
주식회사 테그웨이 TEGWAY CO., LTD. [KR/KR]; 대전시 유성구 문지로 193, 에프 532호 #F-532, 193, Munji-ro Yuseong-gu Daejeon 34051, KR
Inventors:
이경수 YI, Kyoung Soo; KR
노진성 NOH, Jin Seong; KR
Agent:
특허법인 아이피에스 IPS PATENT FIRM; 서울시 서초구 반포대로23길 14, 5층 5th Fl., 14, Banpo-daero 23gil Seocho-gu Seoul 06656, KR
Priority Data:
10-2017-006259719.05.2017KR
10-2017-006259919.05.2017KR
10-2017-006260019.05.2017KR
10-2017-011146331.08.2017KR
10-2017-011146631.08.2017KR
62/415,43731.10.2016US
Title (EN) FLEXIBLE THERMOELECTRIC MODULE AND THERMOELECTRIC APPARATUS COMPRISING SAME
(FR) MODULE THERMOÉLECTRIQUE FLEXIBLE ET APPAREIL THERMOÉLECTRIQUE COMPRENANT LEDIT MODULE
(KO) 유연 열전 모듈 및 이를 포함하는 열전 장치
Abstract:
(EN) The present invention relates to a flexible thermoelectric module and, more specifically, to a flexible thermoelectric module used in the shape of a curved surface. A flexible thermoelectric module used in the shape of a curved surface according to the present invention comprises: a substrate provided in a plate shape transformable into the shape of a curved surface; a plurality of thermoelectric devices comprising an N-type semiconductor and a P-type semiconductor disposed so as to form a two-dimensional array on the substrate; and a plurality of electrodes connecting the N-type semiconductor and P-type semiconductor, wherein the plurality of thermoelectric devices form a thermoelectric line comprising thermoelectric devices consecutively connected by means of the electrodes and forming a line, wherein an extension direction of the thermoelectric line can be closer to a direction perpendicular to a curving direction for transformation into the shape of a curved surface than the curving direction.
(FR) La présente invention concerne un module thermoélectrique flexible et, plus spécifiquement, un module thermoélectrique flexible utilisé sous la forme d'une surface incurvée. Le module thermoélectrique flexible utilisé sous la forme d'une surface incurvée selon la présente invention comprend : un substrat disposé sous une forme de plaque transformable en forme de surface incurvée ; une pluralité de dispositifs thermoélectriques comprenant un semi-conducteur de type N et un semi-conducteur de type P disposés de façon à former un réseau bidimensionnel sur le substrat ; et une pluralité d'électrodes connectant le semi-conducteur de type N et le semi-conducteur de type P, la pluralité de dispositifs thermoélectriques formant une ligne thermoélectrique comprenant des dispositifs thermoélectriques connectés consécutivement au moyen des électrodes et formant une ligne, une direction d'extension de la ligne thermoélectrique pouvant être plus proche d'une direction perpendiculaire à une direction de courbure pour la transformation en la forme d'une surface plus incurvée que la direction de courbure.
(KO) 본 발명은 유연 열전 모듈에 관한 것으로, 보다 상세하게는 곡면 형태로 이용되는 유연 열전 모듈에 관한 것이다. 본 발명에 따른 유연 열전 모듈은, 곡면 형태로 이용되는 유연 열전 모듈로서, 곡면 형태로 변형 가능한 판상으로 제공되는 기판; 상기 기판에 2차원 어레이를 형성하도록 배치되는 N형 반도체 및 P형 반도체를 포함하는 복수의 열전 소자; 및 상기 N형 반도체와 상기 P형 반도체를 연결하는 복수의 전극;을 포함하되, 상기 복수의 열전 소자는, 상기 전극에 의해 연속적으로 연결되며 선형을 이루는 열전 소자들을 포함하는 열전 라인을 형성하되, 상기 열전 라인의 연장 방향은, 상기 곡면 형태로 변형되기 위한 커빙 방향보다 상기 커빙 방향에 수직한 방향에 가까울 수 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)