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1. (WO2018079982) METHOD FOR MANUFACTURING BIDIRECTIONAL CONDUCTIVE MODULE USING ULTRA PRECISION MACHINING TECHNOLOGY AND METHOD FOR MANUFACTURING BIDIRECTIONAL CONDUCTIVE TEST MODULE USING SAME

Pub. No.:    WO/2018/079982    International Application No.:    PCT/KR2017/007379
Publication Date: Fri May 04 01:59:59 CEST 2018 International Filing Date: Wed Jul 12 01:59:59 CEST 2017
IPC: G01R 1/04
G01R 3/00
G01R 31/28
Applicants: INNO GLOBAL INC.
주식회사 이노글로벌
Inventors: MOON, Haejoong
문해중
LEE, Jihyung
이지형
LEE, Eunjou
이은주
Title: METHOD FOR MANUFACTURING BIDIRECTIONAL CONDUCTIVE MODULE USING ULTRA PRECISION MACHINING TECHNOLOGY AND METHOD FOR MANUFACTURING BIDIRECTIONAL CONDUCTIVE TEST MODULE USING SAME
Abstract:
The present invention relates to a bidirectional conductive pin using carbon fibers and a bidirectional conductive pattern module using carbon fibers, and a bidirectional conductive socket using the same. The bidirectional conductive pin using carbon fibers according to the present invention comprises: a pin body made of an insulating material having elasticity; and a plurality of conductive wire members formed in the pin body such that an upper portion thereof is exposed to an upper portion of the pin body and a lower portion thereof is exposed to a lower portion of the pin body, wherein the plurality of conductive wire members are arranged in a mutually twisted manner along a vertical direction inside the pin body, and each of the conductive wire members comprises carbon fibers and a conductive outer skin which is applied on an outer surface of the carbon fibers so as for the conductive wire members to have conductivity. Accordingly, it is possible to replace pogo-pin type semiconductor test sockets and test at high speed with stable signal transmission, and furthermore, it is possible to implement pitch-free sockets, and apply such to an interposer between a high-speed CPU and a board that electrically connects the CPU and the board.