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1. (WO2018079788) SUBSTRATE FOR PROBE CARD, PROBE CARD, AND INSPECTION DEVICE
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Pub. No.: WO/2018/079788 International Application No.: PCT/JP2017/039183
Publication Date: 03.05.2018 International Filing Date: 30.10.2017
IPC:
G01R 1/04 (2006.01) ,C04B 35/596 (2006.01) ,G01R 1/073 (2006.01) ,H01L 21/66 (2006.01)
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1
Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02
General constructional details
04
Housings; Supporting members; Arrangements of terminals
C CHEMISTRY; METALLURGY
04
CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
B
LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
35
Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
515
based on non-oxides
58
based on borides, nitrides or silicides
584
based on silicon nitride
587
Fine ceramics
596
Composites
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1
Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02
General constructional details
06
Measuring leads; Measuring probes
067
Measuring probes
073
Multiple probes
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
Applicants:
京セラ株式会社 KYOCERA CORPORATION [JP/JP]; 京都府京都市伏見区竹田鳥羽殿町6番地 6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501, JP
Inventors:
今井 寅浩 IMAI, Tomohiro; JP
Agent:
深井 敏和 FUKAI, Toshikazu; JP
Priority Data:
2016-21258231.10.2016JP
Title (EN) SUBSTRATE FOR PROBE CARD, PROBE CARD, AND INSPECTION DEVICE
(FR) SUBSTRAT POUR CARTE SONDE, CARTE SONDE ET DISPOSITIF D'INSPECTION
(JA) プローブカード用基板、プローブカード、および検査装置
Abstract:
(EN) This substrate for a probe card is provided with a plurality of through-holes in which probes are disposed, the probes being brought into contact with a substance to be measured. The substrate comprises a silicon nitride ceramic, is provided with a first surface facing the substance to be measured and a second surface positioned opposite from the first surface, and includes a plurality of metal silicide crystal phases. The metal constituting part of the metal silicide is at least one selected from molybdenum, chrome, iron, nickel, manganese, vanadium, niobium, tantalum, cobalt, and tungsten.
(FR) L'invention concerne un substrat pour carte sonde pourvu d'une pluralité de trous traversants dans lesquels des sondes sont disposées, les sondes étant mises en contact avec une substance à mesurer. Le substrat comprend une céramique en nitrure de silicium, est pourvu d'une première surface faisant face à la substance à mesurer et d'une seconde surface positionnée à l'opposé de la première surface, et comprend une pluralité de phases cristallines de siliciure métallique. Le métal constituant une partie du siliciure métallique est au moins un élément choisi parmi le molybdène, le chrome, le fer, le nickel, le manganèse, le vanadium, le niobium, le tantale, le cobalt et le tungstène.
(JA) 本開示のプローブカード用基板は、測定対象物に当接させるプローブが配置される貫通孔を複数備える。窒化珪素質セラミックスからなり、前記測定対象物に対向する第1面と、該第1面の反対に位置する第2面とを備え、金属珪化物の結晶相を複数含んでおり、前記金属珪化物を構成する金属が、モリブデン、クロム、鉄、ニッケル、マンガン、バナジウム、ニオブ、タンタル、コバルトおよびタングステンから選ばれる少なくとも1種である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)