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1. (WO2018079644) SUBSTRATE FOR IMAGING ELEMENT MOUNTING, IMAGING DEVICE AND IMAGING MODULE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/079644 International Application No.: PCT/JP2017/038663
Publication Date: 03.05.2018 International Filing Date: 26.10.2017
IPC:
H01L 27/146 (2006.01) ,H01L 23/12 (2006.01) ,H01L 25/04 (2014.01) ,H01L 25/18 (2006.01) ,H04N 5/225 (2006.01) ,H04N 5/369 (2011.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144
Devices controlled by radiation
146
Imager structures
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
222
Studio circuitry; Studio devices; Studio equipment
225
Television cameras
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
N
PICTORIAL COMMUNICATION, e.g. TELEVISION
5
Details of television systems
30
Transforming light or analogous information into electric information
335
using solid-state image sensors [SSIS]
369
SSIS architecture; Circuitry associated therewith
Applicants: KYOCERA CORPORATION[JP/JP]; 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501, JP
Inventors: KOHAMA, Kenichi; JP
TAKESHITA, Fumiaki; JP
Priority Data:
2016-21050027.10.2016JP
Title (EN) SUBSTRATE FOR IMAGING ELEMENT MOUNTING, IMAGING DEVICE AND IMAGING MODULE
(FR) SUBSTRAT POUR MONTAGE D'ÉLÉMENT D'IMAGERIE, DISPOSITIF D'IMAGERIE ET MODULE D'IMAGERIE
(JA) 撮像素子実装用基体、撮像装置および撮像モジュール
Abstract:
(EN) This substrate for imaging element mounting is provided with: a substrate; a first electrode pad and a second electrode pad; and a third electrode pad and a fourth electrode pad. The substrate has an upper surface that comprises a first mounting region on which a first imaging element is mounted and a second mounting region on which a second imaging element is mounted. The first electrode pad and the second electrode pad are arranged on the upper surface of the substrate so that the first mounting region is positioned therebetween. The third electrode pad and the fourth electrode pad are arranged on the upper surface of the substrate so that the second mounting region is positioned therebetween. The upper surface of the substrate is provided with a recess between the third electrode pad and the fourth electrode pad; and the second mounting region is positioned on the bottom surface of the recess.
(FR) L'invention concerne un substrat pour montage d'élément d'imagerie comprenant : un substrat; un premier plot d'électrode et un second plot d'électrode; et un troisième plot d'électrode et un quatrième plot d'électrode. Le substrat a une surface supérieure qui comprend une première région de montage sur laquelle un premier élément d'imagerie est monté et une seconde région de montage sur laquelle un second élément d'imagerie est monté. Le premier plot d'électrode et le second plot d'électrode sont disposés sur la surface supérieure du substrat de telle sorte que la première région de montage est positionnée entre eux. Le troisième plot d'électrode et le quatrième plot d'électrode sont disposés sur la surface supérieure du substrat de telle sorte que la seconde région de montage est positionnée entre eux. La surface supérieure du substrat comprend un évidement entre le troisième plot d'électrode et le quatrième plot d'électrode; et la seconde région de montage est positionnée sur la surface inférieure de l'évidement.
(JA) 撮像素子実装用基体は、基体と、第1電極パッドおよび第2電極パッドと、第3電極パッドおよび第4電極パッドとを備えている。基体は、上面に第1撮像素子が実装される第1実装領域と、第2撮像素子が実装される第2実装領域とを有する。第1電極パッドおよび第2電極パッドは、基体の上面に、第1実装領域が間に位置している。第3電極パッドおよび第4電極パッドは、基体の上面に、第2実装領域が間に位置している。基体の上面には、第3電極パッドと第4電極パッドとの間に凹部を有しており、第2実装領域は凹部の底面に位置している。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)