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1. (WO2018079596) MOLD RELEASE FILM
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/079596 International Application No.: PCT/JP2017/038499
Publication Date: 03.05.2018 International Filing Date: 25.10.2017
IPC:
B32B 27/00 (2006.01) ,B32B 27/30 (2006.01) ,B32B 27/36 (2006.01) ,C09J 7/00 (2018.01)
Applicants: MITSUBISHI CHEMICAL CORPORATION[JP/JP]; 1-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1008251, JP
Inventors: HIRAKI, Toshihiro; JP
Agent: SASAKI, Wataru; JP
Priority Data:
2016-20893725.10.2016JP
Title (EN) MOLD RELEASE FILM
(FR) FILM DE DÉMOULAGE
(JA) 離型フィルム
Abstract: front page image
(EN) A mold release film having a mold release layer comprising a cured material formed from a curable silicone resin and inert particles on at least one surface of a polyester film, the peel force between the mold release layer and an acrylic adhesive measured by a predetermined method being 50 g/25 mm to 150 g/25 mm.
(FR) La présente invention concerne un film de démoulage ayant une couche de démoulage comprenant un matériau durci formé à partir d'une résine de silicone durcissable et de particules inertes sur au moins une surface d'un film de polyester, la force de décollement entre la couche de démoulage et un adhésif acrylique mesuré par un procédé prédéterminé étant comprise entre 50 g/25 mm et 150 g/25 mm.
(JA) ポリエステルフィルムの少なくとも片面に、硬化型シリコーン樹脂及び不活性粒子から形成された硬化物からなる離型層を有し、所定の方法で測定した該離型層とアクリル系粘着剤との剥離力が、50g/25mm以上150g/25mm以下である離型フィルム。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)