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1. (WO2018079552) ELECTRONIC DEVICE PRODUCTION METHOD, ADHESIVE FILM FOR ELECTRONIC DEVICE PRODUCTION, AND ELECTRONIC COMPONENT TESTING DEVICE

Pub. No.:    WO/2018/079552    International Application No.:    PCT/JP2017/038366
Publication Date: Fri May 04 01:59:59 CEST 2018 International Filing Date: Wed Oct 25 01:59:59 CEST 2017
IPC: G01R 31/26
C09J 7/02
H01L 21/301
H01L 21/66
Applicants: MITSUI CHEMICALS TOHCELLO, INC.
三井化学東セロ株式会社
Inventors: HAYASHISHITA Eiji
林下 英司
Title: ELECTRONIC DEVICE PRODUCTION METHOD, ADHESIVE FILM FOR ELECTRONIC DEVICE PRODUCTION, AND ELECTRONIC COMPONENT TESTING DEVICE
Abstract:
This electronic device production method includes: a step (A) for preparing a structure which is provided with an adhesive film and one or more electronic components attached to the adhesive surface of the film; a step (B) for placing the structure within an electronic component testing device equipped with a sample stage which has an electronic component placement region and a probe card which is provided in a position opposite the sample stage and which is provided with probe terminals, the structure being placed in the electronic component testing device such that the electronic component is positioned upon the electronic component placement region of the sample stage with the adhesive film therebetween; a step (C) for evaluating the properties of the electronic component by bringing the probe terminals into contact with the terminals of the electronic component while the electronic component is attached to the adhesive film; and a step (D) for thereafter picking up the electronic component from the adhesive film. Additionally, the sample stage is provided with a first vacuum suctioning means for vacuum suctioning the adhesive film in a region on the outer peripheral side that differs from the electronic component placement region, and in at least step (C), the region of the adhesive film to which the electronic component is not attached is vacuum suctioned by the first vacuum suctioning means.