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1. (WO2018079534) THERMALLY CONDUCTIVE PASTE AND ELECTRONIC DEVICE
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Pub. No.: WO/2018/079534 International Application No.: PCT/JP2017/038315
Publication Date: 03.05.2018 International Filing Date: 24.10.2017
IPC:
H01L 21/52 (2006.01) ,C08K 3/00 (2018.01) ,C08L 101/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52
Mounting semiconductor bodies in containers
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
Applicants:
住友ベークライト株式会社 SUMITOMO BAKELITE CO., LTD. [JP/JP]; 東京都品川区東品川2丁目5番8号 5-8, Higashi-Shinagawa 2-chome, Shinagawa-ku, Tokyo 1400002, JP
Inventors:
牧原 康二 MAKIHARA Koji; JP
Agent:
速水 進治 HAYAMI Shinji; JP
Priority Data:
2016-21366431.10.2016JP
Title (EN) THERMALLY CONDUCTIVE PASTE AND ELECTRONIC DEVICE
(FR) PÂTE THERMOCONDUCTRICE ET DISPOSITIF ÉLECTRONIQUE
(JA) 熱伝導性ペーストおよび電子装置
Abstract:
(EN) A thermally conductive paste including a thermosetting resin and a thermally conductive filler and having a wet spreading area ratio of at least 90%. When the average particle diameter D50 of the thermally conductive filler is D, the viscosity, at a room temperature of 25°C, of the thermally conductive paste excluding the thermally conductive filler is η, and the degree of sedimentation of the thermally conductive filler in the thermally conductive paste is S = D2/η, S is 8 [10-12·m3·s/kg] – 900 [10-12·m3·s/kg].
(FR) L'invention concerne une pâte thermoconductrice comprenant une résine thermodurcissable et une charge thermoconductrice et ayant un rapport de surface d'étalement humide d'au moins 90 %. Lorsque le diamètre moyen de particule D50 de la charge thermoconductrice est D, la viscosité, à une température ambiante de 25 °C, de la pâte thermoconductrice à l'exclusion de la charge thermoconductrice est η, et le degré de sédimentation de la charge thermoconductrice dans la pâte thermoconductrice est S = D2/η, S est 8 [10-12·m3·s/kg] – 900 [10-12·m3·s/kg].
(JA) 本発明の熱伝導性ペーストは、熱硬化性樹脂と熱伝導性フィラーとを含むものであり、濡れ広がり面積の割合が90%以上であり、熱伝導性フィラーの平均粒径D50をDとし、熱伝導性フィラーを除いた当該熱伝導性ペーストの、室温25℃における粘度をηとし、当該熱伝導性ペースト中における熱伝導性フィラーの沈降度合いを、S=D/ηとしたとき、Sが8[10-12・m・s/kg]以上900[10-12・m・s/kg]以下である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)