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|1. (WO2018079466) RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, DAM AGENT, SEMICONDUCTOR DEVICE AND IMAGE SENSOR MODULE|
|Title:||RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, DAM AGENT, SEMICONDUCTOR DEVICE AND IMAGE SENSOR MODULE|
Provided is a resin composition which is able to be cured fast at low temperatures, while having high bonding strength (especially, high peel strength) after curing, and which is capable of suppressing decrease in the bonding strength (especially, in the peel strength) after a moisture resistance test of the resin composition after curing, while having excellent pot life. The present invention provides a resin composition which contains (A) an epoxy resin, (B) a thiol compound represented by C(CH2OR1)(CH2OR2)(CH2OR3)(CH2OR4) (wherein each of R1, R2, R3 and R4 independently represents a hydrogen atom or CnH2nSH (wherein n represents a number of 2-6); and at least one of R1, R2, R3 and R4 represents CnH2nSH (wherein n represents a number of 2-6), (b) a thiol compound other than the component (b), and (C) a latent curing accelerator.