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1. (WO2018079466) RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, DAM AGENT, SEMICONDUCTOR DEVICE AND IMAGE SENSOR MODULE

Pub. No.:    WO/2018/079466    International Application No.:    PCT/JP2017/038137
Publication Date: Fri May 04 01:59:59 CEST 2018 International Filing Date: Tue Oct 24 01:59:59 CEST 2017
IPC: C08G 59/66
C09J 11/06
C09J 163/00
C09K 3/10
H01L 23/29
H01L 23/31
Applicants: NAMICS CORPORATION
ナミックス株式会社
Inventors: IWAYA, Kazuki
岩谷 一希
ARAI, Fuminori
新井 史紀
Title: RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, DAM AGENT, SEMICONDUCTOR DEVICE AND IMAGE SENSOR MODULE
Abstract:
Provided is a resin composition which is able to be cured fast at low temperatures, while having high bonding strength (especially, high peel strength) after curing, and which is capable of suppressing decrease in the bonding strength (especially, in the peel strength) after a moisture resistance test of the resin composition after curing, while having excellent pot life. The present invention provides a resin composition which contains (A) an epoxy resin, (B) a thiol compound represented by C(CH2OR1)(CH2OR2)(CH2OR3)(CH2OR4) (wherein each of R1, R2, R3 and R4 independently represents a hydrogen atom or CnH2nSH (wherein n represents a number of 2-6); and at least one of R1, R2, R3 and R4 represents CnH2nSH (wherein n represents a number of 2-6), (b) a thiol compound other than the component (b), and (C) a latent curing accelerator.