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1. (WO2018079429) LAMINATE FILM, ELECTRONIC DEVICE MEMBER, AND ELECTRONIC DEVICE
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Pub. No.: WO/2018/079429 International Application No.: PCT/JP2017/037972
Publication Date: 03.05.2018 International Filing Date: 20.10.2017
IPC:
B32B 7/02 (2006.01) ,C23C 14/06 (2006.01) ,C23C 16/42 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/04 (2006.01) ,H05B 33/28 (2006.01) ,B32B 9/00 (2006.01) ,B32B 27/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
7
Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers
02
in respect of physical properties, e.g. hardness
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06
characterised by the coating material
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
22
characterised by the deposition of inorganic material, other than metallic material
30
Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
42
Silicides
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
02
Details
04
Sealing arrangements
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
12
Light sources with substantially two-dimensional radiating surfaces
26
characterised by the composition or arrangement of the conductive material used as an electrode
28
of translucent electrodes
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
9
Layered products essentially comprising a particular substance not covered by groups B32B11/-B32B29/137
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
Applicants:
リンテック株式会社 LINTEC CORPORATION [JP/JP]; 東京都板橋区本町23‐23 23-23, Honcho, Itabashi-ku, Tokyo 1730001, JP
Inventors:
永縄 智史 NAGANAWA Satoshi; JP
大橋 健寛 OHASHI Takehiro; JP
岩屋 渉 IWAYA Wataru; JP
Agent:
大石 治仁 OHISHI Haruhito; JP
Priority Data:
2016-21151728.10.2016JP
Title (EN) LAMINATE FILM, ELECTRONIC DEVICE MEMBER, AND ELECTRONIC DEVICE
(FR) FILM STRATIFIÉ, ÉLÉMENT DE DISPOSITIF ÉLECTRONIQUE ET DISPOSITIF ÉLECTRONIQUE
(JA) 積層フィルム、電子デバイス用部材、及び電子デバイス
Abstract:
(EN) The present invention provides a laminate film comprising at least a base material and a gas barrier layer, characterized in that an elongation (ε) occurring in a surface of the gas barrier layer calculated by a formula (1) is 0.8% or less. An electronic device member comprises the laminate film, and an electronic device is provided with the electronic device member. In formula (1), T represents a distance [m] from a surface farthest from the gas barrier layer in a thickness direction of the laminate film to the gas barrier layer, and λ represents a distance, from the surface of the laminate film, of an imaginary plane (α) of the laminate film in which stress does not occur. The present invention provides a laminate film with excellent gas barrier properties and bending properties, an electronic device member comprising the laminate film, and an electronic device provided with the electronic device member.
(FR) La présente invention concerne un film stratifié comprenant au moins un matériau de base et une couche barrière aux gaz, caractérisé en ce qu'un allongement (ε) se produisant dans une surface de la couche barrière aux gaz calculé par une formule (1) est inférieur ou égal à 0,8 %. Un élément de dispositif électronique comprend le film stratifié, et un dispositif électronique est pourvu de l'élément de dispositif électronique. Dans la formule (1), T représente une distance [m] d'une surface la plus éloignée de la couche barrière aux gaz dans une direction d'épaisseur du film stratifié à la couche barrière aux gaz, et λ représente une distance, de la surface du film stratifié, d'un plan imaginaire (α) du film stratifié dans lequel la contrainte ne se produit pas. La présente invention concerne un film stratifié possédant d'excellentes propriétés de barrière aux gaz et propriétés de flexion, un élément de dispositif électronique comprenant le film stratifié, et un dispositif électronique pourvu de l'élément de dispositif électronique. (Formule 1) ε= (T - λ)/[(3 × 10-3) + λ] × 100
(JA) 本発明は、少なくとも基材と、ガスバリア層を有する積層フィルムであって、下記式(1)で算出される、前記ガスバリア層表面に発生する伸歪(ε)が、0.8%以下であることを特徴とする積層フィルムと、この積層フィルムからなる電子デバイス用部材、及び、この電子デバイス用部材を備える電子デバイスである。式(1)中、Tは、積層フィルムの厚み方向において、ガスバリア層から最も離れた表面からガスバリア層までの距離[m]であり、λは、積層フィルム中の応力が発生しない仮想の面(α)の、積層フィルムの前記表面からの距離である。本発明によれば、ガスバリア性及び屈曲性に優れる積層フィルムと、この積層フィルムからなる電子デバイス用部材、及び、この電子デバイス用部材を備える電子デバイスが提供される。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)