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1. (WO2018079331) SOLID-STATE IMAGING DEVICE, SIGNAL PROCESSING METHOD THEREOF, AND ELECTRONIC DEVICE

Pub. No.:    WO/2018/079331    International Application No.:    PCT/JP2017/037476
Publication Date: Fri May 04 01:59:59 CEST 2018 International Filing Date: Wed Oct 18 01:59:59 CEST 2017
IPC: H04N 5/378
G06T 1/20
H01L 27/146
H04N 5/341
H04N 5/374
Applicants: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
ソニーセミコンダクタソリューションズ株式会社
Inventors: SHIDA Sayaka
志田 さや香
Title: SOLID-STATE IMAGING DEVICE, SIGNAL PROCESSING METHOD THEREOF, AND ELECTRONIC DEVICE
Abstract:
The present technology relates to: a solid-state imaging device which is capable of coping with an arbitrary change in an imaging process of a pixel array unit; a signal processing method thereof; and an electronic device. The solid-state imaging device is provided with: a pixel array unit in which a plurality of pixels are arrayed in a two-dimensional array shape; an analog-to-digital (AD) conversion unit which AD-converts a pixel signal output from a pixel of the pixel array unit; a memory which holds the digital pixel signal obtained after the AD conversion; and an image signal processing circuit which performs a prescribed signal processing on the digital pixel signal. The image signal processing circuit is provided with: one or more processing elements (PEs) which execute a prescribed calculation process; two or more processing units (PUs), each of which is formed of a control unit (CU) which operates the PEs in an SIMD format, an IMEM which stores one or more calculation processing commands; and a CCU which controls the PUs. The present technology can be applied to, for example, a solid-state imaging device or the like that allows a plurality of regions of a pixel array unit to be processed differently.