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|1. (WO2018079309) THERMALLY-CONDUCTIVE SILICONE COMPOSITION|
|Applicants:||SHIN-ETSU CHEMICAL CO., LTD.
|Title:||THERMALLY-CONDUCTIVE SILICONE COMPOSITION|
This thermally-conductive silicone composition comprises: (A) an organopolysiloxane having two or more alkenyl groups per molecule, and having a kinetic viscosity of 10-100,000 mm2/s at 25°C, (B) a hydrolyzable methyl polysiloxane which is represented by formula (1) (R1 represents an alkyl group, and a is 5-100) and of which one end is trifunctional, (C) a thermally-conductive filler having a thermal conductivity of 10 W/m·°C or more, (D) an organohydrogen polysiloxane having two or more Si-H groups per molecule, (E) a catalyst selected from the group consisting of platinum and platinum compounds, and (F) a benzotriazole derivative represented by formula (2) (R2 represents H or a monovalent hydrocarbon group, and R3 represents a monovalent organic group). The composition can inhibit the decrease of the curing speed. A cured product of the composition has a small hardness increase when being aged at a high temperature, and has a small heat resistance increase after undergoing a heat cycle test.