Search International and National Patent Collections

1. (WO2018079309) THERMALLY-CONDUCTIVE SILICONE COMPOSITION

Pub. No.:    WO/2018/079309    International Application No.:    PCT/JP2017/037176
Publication Date: Fri May 04 01:59:59 CEST 2018 International Filing Date: Sat Oct 14 01:59:59 CEST 2017
IPC: C08L 83/07
C08K 3/00
C08K 5/3475
C08L 83/05
C08L 83/06
Applicants: SHIN-ETSU CHEMICAL CO., LTD.
信越化学工業株式会社
Inventors: TSUJI Kenici
辻 謙一
KATO Nobu
加藤 野歩
HIROKAMI Munenao
廣神 宗直
Title: THERMALLY-CONDUCTIVE SILICONE COMPOSITION
Abstract:
This thermally-conductive silicone composition comprises: (A) an organopolysiloxane having two or more alkenyl groups per molecule, and having a kinetic viscosity of 10-100,000 mm2/s at 25°C, (B) a hydrolyzable methyl polysiloxane which is represented by formula (1) (R1 represents an alkyl group, and a is 5-100) and of which one end is trifunctional, (C) a thermally-conductive filler having a thermal conductivity of 10 W/m·°C or more, (D) an organohydrogen polysiloxane having two or more Si-H groups per molecule, (E) a catalyst selected from the group consisting of platinum and platinum compounds, and (F) a benzotriazole derivative represented by formula (2) (R2 represents H or a monovalent hydrocarbon group, and R3 represents a monovalent organic group). The composition can inhibit the decrease of the curing speed. A cured product of the composition has a small hardness increase when being aged at a high temperature, and has a small heat resistance increase after undergoing a heat cycle test.