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1. (WO2018079304) COPPER ALLOY POWDER, LAMINATE MOLDING PRODUCTION METHOD, AND LAMINATE MOLDING
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/079304    International Application No.:    PCT/JP2017/037142
Publication Date: 03.05.2018 International Filing Date: 13.10.2017
IPC:
B22F 1/00 (2006.01), B22F 3/105 (2006.01), B22F 3/16 (2006.01), B22F 3/24 (2006.01), B33Y 10/00 (2015.01), B33Y 70/00 (2015.01), B33Y 80/00 (2015.01)
Applicants: DAIHEN CORPORATION [JP/JP]; 1-11, Tagawa 2-chome, Yodogawa-ku, Osaka-shi, Osaka 5328512 (JP).
OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY [JP/JP]; 7-1, Ayumino 2-chome, Izumi-shi, Osaka 5941157 (JP)
Inventors: TSUBOTA, Ryusuke; (JP).
OKA, Yohei; (JP).
OKAMOTO, Akira; (JP).
NAKAMOTO, Takayuki; (JP).
SUGAHARA, Takahiro; (JP).
SHINOMIYA, Naruaki; (JP).
TAKEMURA, Mamoru; (JP).
UCHIDA, Sohei; (JP)
Agent: FUKAMI PATENT OFFICE, P.C.; Nakanoshima Festival Tower West, 2-4, Nakanoshima 3-chome, Kita-ku, Osaka-shi, Osaka 5300005 (JP)
Priority Data:
2016-208895 25.10.2016 JP
2017-111709 06.06.2017 JP
2017-193374 03.10.2017 JP
Title (EN) COPPER ALLOY POWDER, LAMINATE MOLDING PRODUCTION METHOD, AND LAMINATE MOLDING
(FR) POUDRE D'ALLIAGE DE CUIVRE, PROCÉDÉ DE PRODUCTION DE MOULAGE DE STRATIFIÉ ET MOULAGE DE STRATIFIÉ
(JA) 銅合金粉末、積層造形物の製造方法および積層造形物
Abstract: front page image
(EN)This copper alloy powder is used for molding a laminate. The copper alloy powder comprises more than 1.00 mass% and at most 2.80 mass% of chromium with the remainder being copper.
(FR)Selon l'invention, cette poudre d'alliage de cuivre est utilisée pour mouler un stratifié. La poudre d'alliage de cuivre comprend plus de 1,00% en masse et au plus 2,80% en masse de chrome, le reste étant du cuivre.
(JA)銅合金粉末は、積層造形用の銅合金粉末である。銅合金粉末は、1.00質量%より多く2.80質量%以下のクロム、および残部の銅を含有する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)