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1. (WO2018079207) LIGHT EMITTING MODULE AND SURFACE LIGHTING DEVICE
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Pub. No.: WO/2018/079207 International Application No.: PCT/JP2017/035975
Publication Date: 03.05.2018 International Filing Date: 03.10.2017
IPC:
H01L 33/48 (2010.01) ,F21S 2/00 (2016.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
S
NON-PORTABLE LIGHTING DEVICES OR SYSTEMS THEREOF
2
Systems of lighting devices, not provided for in main groups F21S4/-F21S10/119
Applicants:
ミネベアミツミ株式会社 MINEBEA MITSUMI INC. [JP/JP]; 長野県北佐久郡御代田町大字御代田4106-73 4106-73 Oaza Miyota, Miyota-machi, Kitasaku-gun, Nagano 3890293, JP
Inventors:
森下 友晶 MORISHITA, Tomoaki; JP
Agent:
特許業務法人虎ノ門知的財産事務所 TORANOMON INTELLECTUAL PROPERTY FIRM; 東京都港区虎ノ門2丁目4番1号 4-1, Toranomon 2-chome, Minato-ku, Tokyo 1050001, JP
Priority Data:
2016-20955326.10.2016JP
Title (EN) LIGHT EMITTING MODULE AND SURFACE LIGHTING DEVICE
(FR) MODULE ÉLECTROLUMINESCENT ET DISPOSITIF D'ÉCLAIRAGE DE SURFACE
(JA) 発光モジュール及び面状照明装置
Abstract:
(EN) A light emitting module (20, 42, 52) according to one embodiment of the present invention is provided with: a light source (22, 37) which emits light; a flexible substrate (21, 61) which has a first surface (21a, 61a) and a second surface (21b, 61b) that is on the reverse side of the first surface (21a, 61a), and which has the light source (22, 37) mounted on the first surface (21a, 61a) with solders (30a, 30b) being interposed therebetween; and a reinforcing member (23, 63) which is provided in a region of the second surface (21b, 61b), said region being on the reverse side of the region of the first surface (21a, 61a) where the solders (30a, 30b) are bonded.
(FR) L'invention concerne un module électroluminescent (20, 42, 52), lequel module, selon un mode de réalisation de la présente invention, comprend : une source de lumière (22, 37) qui émet de la lumière ; un substrat souple (21, 61) qui présente une première surface (21a, 61a) et une seconde surface (21b, 61b) située sur le côté inverse de la première surface (21a, 61a), la source de lumière (22, 37) étant montée sur la première surface (21a, 61a) dudit substrat souple (21, 61), des soudures (30a, 30b) étant intercalées entre ces dernières ; et un élément de renforcement (23, 63) disposé dans une région de la seconde surface (21b, 61b), ladite région étant du côté inverse de la région de la première surface (21a, 61a) sur laquelle les soudures (30a, 30b) sont fixées.
(JA) 実施形態の発光モジュール(20,42,52)は、光を発する光源(22,37)と、可撓性を有し、かつ、第1の面(21a,61a)及び前記第1の面(21a,61a)とは反対側の第2の面(21b,61b)を有し、前記第1の面(21a,61a)に前記光源(22,37)が半田(30a,30b)を介して実装される基板(21,61)と、前記半田(30a,30b)が接続される前記第1の面(21a,61a)の領域とは反対側の前記第2の面(21b,61b)の領域に設けられる補強部材(23,63)と、を備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)