Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018079055) PLATING METHOD, PLATING DEVICE, AND STORAGE MEDIUM
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/079055 International Application No.: PCT/JP2017/030993
Publication Date: 03.05.2018 International Filing Date: 29.08.2017
IPC:
C23C 18/18 (2006.01) ,C23C 18/31 (2006.01) ,H05K 3/18 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
18
Pretreatment of the material to be coated
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
31
Coating with metals
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18
using precipitation techniques to apply the conductive material
Applicants:
東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP/JP]; 東京都港区赤坂五丁目3番1号 3-1, Akasaka 5-chome, Minato-ku, Tokyo 1076325, JP
Inventors:
稲富 裕一郎 INATOMI Yuichiro; JP
田中 崇 TANAKA Takashi; JP
岩井 和俊 IWAI Kazutoshi; JP
Agent:
永井 浩之 NAGAI Hiroshi; JP
中村 行孝 NAKAMURA Yukitaka; JP
佐藤 泰和 SATO Yasukazu; JP
朝倉 悟 ASAKURA Satoru; JP
森 秀行 MORI Hideyuki; JP
村田 卓久 MURATA Takahisa; JP
Priority Data:
2016-21091427.10.2016JP
Title (EN) PLATING METHOD, PLATING DEVICE, AND STORAGE MEDIUM
(FR) PROCÉDÉ DE PLACAGE, DISPOSITIF DE PLACAGE ET SUPPORT DE STOCKAGE
(JA) めっき処理方法、めっき処理装置及び記憶媒体
Abstract:
(EN) The present invention involves: preparing a substrate (W) that has an unplatable material portion (31) and a platable material portion (32) formed on the surface thereof; performing a catalyst application treatment on the substrate (W) so as to selectively apply a catalyst to the platable material portion (32); and then supplying a plating liquid (M1) to the substrate (W) so as to selectively form a plating layer (35) on the platable material portion (32). The plating liquid (M1) contains an inhibitor that suppresses precipitation of the plating layer (35) on the unplatable material portion (31).
(FR) La présente invention consiste : à préparer un substrat (W) pourvu d'une partie de matériau ne pouvant pas être plaquée (31) et d'une partie de matériau pouvant être plaquée (32) formées sur sa surface ; à réaliser un traitement d'application de catalyseur sur le substrat (W) de sorte à appliquer de façon sélective un catalyseur sur la partie de matériau pouvant être plaquée (32) ; puis à acheminer un liquide de placage (M1) jusqu'au substrat (W) de sorte à former de façon sélective une couche de placage (35) sur la partie de matériau pouvant être plaquée (32). Le liquide de placage (M1) contient un inhibiteur qui supprime la précipitation de la couche de placage (35) sur la partie de matériau ne pouvant pas être plaquée (31).
(JA) 表面にめっき不可材料部分(31)とめっき可能材料部分(32)とが形成された基板(W)を準備し、基板(W)に対して触媒付与処理を行うことにより、めっき可能材料部分(32)に対して選択的に触媒を付与する。次に、基板(W)に対してめっき液(M1)を供給することにより、めっき可能材料部分(32)に対して選択的にめっき層(35)を形成する。めっき液(M1)は、めっき不可材料部分(31)にめっき層(35)が析出することを抑制する抑制剤を含有する。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)