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1. (WO2018078705) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Pub. No.:    WO/2018/078705    International Application No.:    PCT/JP2016/081492
Publication Date: Fri May 04 01:59:59 CEST 2018 International Filing Date: Tue Oct 25 01:59:59 CEST 2016
IPC: H01L 23/28
H01L 23/48
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: YOSHIMATSU, Naoki
吉松 直樹
USUI, Osamu
碓井 修
IMOTO, Yuji
井本 裕児
Title: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
Abstract:
According to the present invention, first and second emitter electrodes (12, 13) are provided spaced away from each other on an upper surface of a semiconductor chip (9). A wiring member (15) has a first joining part (15a) joined to the first emitter electrode (12) and a second joining part (15b) joined to the second emitter electrode (13). A resin (2) encapsulates the semiconductor chip (9), the first and second emitter electrodes (12, 13), and the wiring member (15). A hole (18) that vertically penetrates the wiring member (15) is provided between the first joining part (15a) and the second joining part (15b).