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1. (WO2018078436) THREE-DIMENSIONALLY SHAPED THERMALLY CONDUCTIVE MOLDED BODY, AND MANUFACTURING METHOD THEREOF
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Pub. No.: WO/2018/078436 International Application No.: PCT/IB2017/001308
Publication Date: 03.05.2018 International Filing Date: 31.10.2017
IPC:
B29C 39/00 (2006.01) ,B29C 39/02 (2006.01) ,B29C 39/10 (2006.01) ,H01L 23/367 (2006.01) ,H01L 23/373 (2006.01) ,H01L 23/433 (2006.01) ,B29K 83/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
39
Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
39
Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
02
for making articles of definite length, i.e. discrete articles
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
39
Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
02
for making articles of definite length, i.e. discrete articles
10
incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367
Cooling facilitated by shape of device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373
Cooling facilitated by selection of materials for the device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
42
Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
433
Auxiliary members characterised by their shape, e.g. pistons
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
K
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D103
83
Use of polymers having silicon, with or without sulfur, nitrogen, oxygen or carbon only, in the main chain, as moulding material
Applicants:
スリ一エム イノべイティブ プロパティズ カンパニ一 3M INNOVATIVE PROPERTIES COMPANY [US/US]; ミネソタ州 セント ポール  ポスト オフィス ボックス 33427 スリ一エム センター 3M Center P. O. Box 33427 St. Paul, Minnesota 55133-3427, US
Inventors:
打矢 智昭 UCHIYA, Tomoaki; JP
阪口 良  SAKAGUCHI, Ryo; JP
高階 任弘  TAKASHINA, Tadahiro; JP
根津 将 NEZU, Masaru; JP
竹之内 崇 TAKENOUCHI, Takashi; JP
Priority Data:
2016-21318431.10.2016JP
2017-15115103.08.2017JP
Title (EN) THREE-DIMENSIONALLY SHAPED THERMALLY CONDUCTIVE MOLDED BODY, AND MANUFACTURING METHOD THEREOF
(FR) CORPS MOULÉ THERMOCONDUCTEUR EN TROIS DIMENSIONS, ET SON PROCÉDÉ DE FABRICATION
(JA) 三次元形状熱伝導性成形体、及びその製造方法
Abstract:
(EN) Provided is a three-dimensionally shaped thermally conductive molded body (1) and manufacturing method thereof, that can ensure sufficient gap filling properties and contact surface area with regard to heat dissipating components such as heat sinks and the like and heat generating components such as IC chips and the like, without adding excessive stress to these components. The three-dimensionally shaped thermally conductive molded body of a first aspect of the present disclosure contains a thermally conductive material and a silicone-based material, the molded body has a substantially flat bottom surface, and a three-dimensional shaped part located on the inside of the bottom surface, and the height of the three-dimensionally shaped part that is higher than the bottom surface differs in at least two locations (a, b).
(FR) L'invention concerne un corps moulé thermoconducteur en trois dimensions (1) et son procédé de fabrication grâce auquel il est possible d'assurer une performance de remplissage d'espace et des zones de contact suffisantes par rapport à des composants de dissipation de chaleur de type puits thermiques et analogues et des composants de génération de chaleur de type puces de circuits intégrés et analogues, sans application de contrainte excessive sur lesdits composants. Un corps moulé thermoconducteur en trois dimensions selon un premier aspect de la présente invention comprend un matériau thermoconducteur et un matériau à base de silicone. Ledit corps moulé présente une surface inférieure sensiblement plate, et une partie en trois dimensions positionnée à l'intérieur de la surface inférieure. La hauteur de la partie en trois dimensions au-dessus de la surface inférieure diffère en au moins deux emplacements (a, b).
(JA) ICチップ等の発熱性部品、ヒートシンク等の放熱部品に対して過度の応力を付加することなく、これらの部品に対して十分な間隙充填性及び接触面積を確保することができる、三次元形状熱伝導性成形体(1)及びその製造方法の提供。本開示の一実施態様の三次元形状熱伝導性成形体は、熱伝導性材料及びシリコーン系材料を含み、該成形体は、略平坦な底面と、該底面内に位置する三次元形状部とを有し、底面より上方の前記三次元形状部の高さが少なくとも2か所(a, b)において相違する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)