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1. (WO2018078436) THREE-DIMENSIONALLY SHAPED THERMALLY CONDUCTIVE MOLDED BODY, AND MANUFACTURING METHOD THEREOF
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/078436 International Application No.: PCT/IB2017/001308
Publication Date: 03.05.2018 International Filing Date: 31.10.2017
IPC:
B29C 39/00 (2006.01) ,B29C 39/02 (2006.01) ,B29C 39/10 (2006.01) ,H01L 23/367 (2006.01) ,H01L 23/373 (2006.01) ,H01L 23/433 (2006.01) ,B29K 83/00 (2006.01)
Applicants: 3M INNOVATIVE PROPERTIES COMPANY[US/US]; 3M Center P. O. Box 33427 St. Paul, Minnesota 55133-3427, US
Inventors: UCHIYA, Tomoaki; JP
SAKAGUCHI, Ryo; JP
TAKASHINA, Tadahiro; JP
NEZU, Masaru; JP
TAKENOUCHI, Takashi; JP
Priority Data:
2016-21318431.10.2016JP
2017-15115103.08.2017JP
Title (EN) THREE-DIMENSIONALLY SHAPED THERMALLY CONDUCTIVE MOLDED BODY, AND MANUFACTURING METHOD THEREOF
(FR) CORPS MOULÉ THERMOCONDUCTEUR EN TROIS DIMENSIONS, ET SON PROCÉDÉ DE FABRICATION
(JA) 三次元形状熱伝導性成形体、及びその製造方法
Abstract: front page image
(EN) Provided is a three-dimensionally shaped thermally conductive molded body (1) and manufacturing method thereof, that can ensure sufficient gap filling properties and contact surface area with regard to heat dissipating components such as heat sinks and the like and heat generating components such as IC chips and the like, without adding excessive stress to these components. The three-dimensionally shaped thermally conductive molded body of a first aspect of the present disclosure contains a thermally conductive material and a silicone-based material, the molded body has a substantially flat bottom surface, and a three-dimensional shaped part located on the inside of the bottom surface, and the height of the three-dimensionally shaped part that is higher than the bottom surface differs in at least two locations (a, b).
(FR) L'invention concerne un corps moulé thermoconducteur en trois dimensions (1) et son procédé de fabrication grâce auquel il est possible d'assurer une performance de remplissage d'espace et des zones de contact suffisantes par rapport à des composants de dissipation de chaleur de type puits thermiques et analogues et des composants de génération de chaleur de type puces de circuits intégrés et analogues, sans application de contrainte excessive sur lesdits composants. Un corps moulé thermoconducteur en trois dimensions selon un premier aspect de la présente invention comprend un matériau thermoconducteur et un matériau à base de silicone. Ledit corps moulé présente une surface inférieure sensiblement plate, et une partie en trois dimensions positionnée à l'intérieur de la surface inférieure. La hauteur de la partie en trois dimensions au-dessus de la surface inférieure diffère en au moins deux emplacements (a, b).
(JA) ICチップ等の発熱性部品、ヒートシンク等の放熱部品に対して過度の応力を付加することなく、これらの部品に対して十分な間隙充填性及び接触面積を確保することができる、三次元形状熱伝導性成形体(1)及びその製造方法の提供。本開示の一実施態様の三次元形状熱伝導性成形体は、熱伝導性材料及びシリコーン系材料を含み、該成形体は、略平坦な底面と、該底面内に位置する三次元形状部とを有し、底面より上方の前記三次元形状部の高さが少なくとも2か所(a, b)において相違する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)