Search International and National Patent Collections

1. (WO2018078385) COATED WAFER

Pub. No.:    WO/2018/078385    International Application No.:    PCT/GB2017/053246
Publication Date: Fri May 04 01:59:59 CEST 2018 International Filing Date: Sat Oct 28 01:59:59 CEST 2017
IPC: H01L 21/20
Applicants: THE UNIVERSITY OF WARWICK
Inventors: MYRONOV, Maksym
COLSTON, Gerard
Title: COATED WAFER
Abstract:
A coated wafer is disclosed. The coated wafer comprises a wafer, such as a silicon or silicon-on-insulator wafer, having a principal surface and a reverse surface comprising a material or respective materials having a cubic crystal structure, such as a diamond or zinc blend crystal structure, and a melting temperature equ al to or greater than 1,250°C. The coated wafer further comprises a layer of 3C-SiC having a thickness of at least 1 nm disposed on the reverse surface or on a dielectric layer supported by the reverse surface.