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1. (WO2018076421) OLED PACKAGING STRUCTURE AND OLED PACKAGING METHOD

Pub. No.:    WO/2018/076421    International Application No.:    PCT/CN2016/106410
Publication Date: Fri May 04 01:59:59 CEST 2018 International Filing Date: Sat Nov 19 00:59:59 CET 2016
IPC: H01L 51/52
H01L 51/56
Applicants: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD
武汉华星光电技术有限公司
Inventors: TANG, Fan
唐凡
Title: OLED PACKAGING STRUCTURE AND OLED PACKAGING METHOD
Abstract:
An OLED packaging structure and an OLED packaging method. The OLED packaging structure (10) comprises a packaging unit (13) and a flexible substrate (11) on which an OLED component (12) is deposited. The packaging unit comprises a first packaging layer (131), a first organic layer (132) and a second packaging layer (133) that are sequentially stacked on the OLED component. The first packaging layer and the second packaging layer are both made of an inorganic material. The first packaging layer comprises a first pixel region (A) and a first pixel defining region (B). The film thickness of the first pixel region is greater than that of the first pixel defining region, and the film thickness of the first pixel defining region gradually reduces from the edge to the inner part of the first pixel defining region. The second packaging layer comprises a second pixel region (A1) corresponding to the first pixel region, and a second pixel defining region (B1) corresponding to the first pixel defining region. The film thickness of the second pixel region is smaller than that of the second pixel defining region, and the film thickness of the second pixel region gradually reduces from the edge to the inner part of the second pixel region.