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1. (WO2018076395) PCB BOARD HEATING METHOD AND APPARATUS, PCB BOARD COMPONENT AND ELECTRONIC DEVICE

Pub. No.:    WO/2018/076395    International Application No.:    PCT/CN2016/104929
Publication Date: Fri May 04 01:59:59 CEST 2018 International Filing Date: Tue Nov 08 00:59:59 CET 2016
IPC: H05K 1/02
Applicants: BANGYAN TECHNOLOGY CO., LTD.
邦彦技术股份有限公司
Inventors: ZHOU, Shixian
周仕贤
ZHANG, Xing
张兴
Title: PCB BOARD HEATING METHOD AND APPARATUS, PCB BOARD COMPONENT AND ELECTRONIC DEVICE
Abstract:
A PCB board (6) heating method and apparatus (100), a PCB board component (60) and an electronic device. In the PCB board (6) heating method, a heating element (2) is embedded in a middle layer of the PCB board (6), and the heating method of the PCB board (6) comprises the following steps: collecting an ambient temperature where the PCB board (6) is located; and controlling the heating element (2) to heat the PCB board (6) when the ambient temperature is less than a pre-set ambient temperature. The PCB board (6) heating method can effectively improve the ability of an electronic device with the PCB board (6) to start normally or work normally in a low temperature environment.