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1. (WO2018076152) APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR WAFERS

Pub. No.:    WO/2018/076152    International Application No.:    PCT/CN2016/103151
Publication Date: Fri May 04 01:59:59 CEST 2018 International Filing Date: Wed Oct 26 01:59:59 CEST 2016
IPC: B08B 3/12
H01L 21/00
Applicants: ACM RESEARCH (SHANGHAI) INC.
Inventors: WANG, Hui
WANG, Xi
CHU, Zhenming
CHEN, Fuping
Title: APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR WAFERS
Abstract:
An apparatus for cleaning a semiconductor wafer comprises a chuck (106), an ultra or mega sonic device, an actuator (113), at least one dispenser (108, 209) and a rotating driving mechanism (111). The chuck (106) holds the semiconductor wafer (105). The actuator (113) drives the ultra or mage sonic device to a position above the surface of the semiconductor wafer (105) and a gap is formed between the ultra or mega sonic device and the surface of the semiconductor wafer (105). The at least one dispenser (108, 209) sprays cleaning liquid on the surface of the semiconductor wafer (105). The rotating driving mechanism drives the chuck (106) to rotate at a spin speed lower than a set spin speed for ensuring that the gap between the ultra or mega sonic device and the surface of the semiconductor wafer (105) is fully and continuously filled with the cleaning liquid (104), making the ultra or mega sonic energy be stably transferred to the entire surface of the semiconductor wafer (105) through the cleaning liquid (104). A method for cleaning a semiconductor wafer is also disclosed.