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1. (WO2018074256) CONDUCTIVE BAR MATERIAL
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Pub. No.: WO/2018/074256 International Application No.: PCT/JP2017/036412
Publication Date: 26.04.2018 International Filing Date: 06.10.2017
IPC:
C25D 7/00 (2006.01) ,C25D 5/12 (2006.01) ,C25D 5/50 (2006.01) ,H01B 5/02 (2006.01) ,H01H 1/025 (2006.01) ,H01R 13/03 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7
Electroplating characterised by the article coated
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
10
Electroplating with more than one layer of the same or of different metals
12
at least one layer being of nickel or chromium
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
48
After-treatment of electroplated surfaces
50
by heat-treatment
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
02
Single bars, rods, wires or strips; Bus-bars
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
H
ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
1
Contacts
02
characterised by the material thereof
021
Composite material
025
having copper as the basic material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
02
Contact members
03
characterised by the material, e.g. plating or coating materials
Applicants:
古河電気工業株式会社 FURUKAWA ELECTRIC CO., LTD. [JP/JP]; 東京都千代田区丸の内2丁目2番3号 2-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008322, JP
Inventors:
北河 秀一 KITAGAWA, Shuichi; JP
橘 昭頼 TACHIBANA, Akira; JP
奥野 良和 OKUNO, Yoshikazu; JP
藤井 恵人 FUJII, Yoshito; JP
中津川 達也 NAKATSUGAWA, Tatsuya; JP
川田 紳悟 KAWATA, Shingo; JP
Agent:
特許業務法人イイダアンドパートナーズ IIDA & PARTNERS; 東京都港区新橋3丁目1番10号 石井ビル3階 ISHII Bldg. 3F, 1-10, Shimbashi 3-chome, Minato-ku, Tokyo 1050004, JP
飯田 敏三 IIDA, Toshizo; JP
赤羽 修一 AKABA, Shuichi; JP
Priority Data:
2016-20362917.10.2016JP
Title (EN) CONDUCTIVE BAR MATERIAL
(FR) MATÉRIAU DE BARRE CONDUCTRICE
(JA) 導電性条材
Abstract:
(EN) [Problem] To provide a conductive bar material which maintains low contact resistance in a high temperature environment and exhibits excellent heat resistance, while having excellently low insertion resistance. [Solution] A conductive bar material which sequentially comprises a layer composed of Ni or an Ni alloy, a layer mainly composed of Cu, and an alloy layer composed of Cu and Sn in this order on a conductive substrate composed of Cu or a Cu alloy, and which is configured such that: the thickness of the layer composed of Ni or an Ni alloy is 0.1-2.0 μm; the thickness of the layer mainly composed of Cu is 0.01-0.1 μm; the thickness of the alloy layer composed of Cu and Sn is 0.1-2.0 μm; the surface roughness Ra is 0.05-1.0 μm; an oxide of Cu and an oxide of Sn are contained in an oxide film that is formed on the surface; the thickness of the oxide film is 50 nm or less; the proportion (%) of the oxide of Sn is 90% or more; and the contact resistance of this bar material after being heated at the temperature of 140°C for 120 hours in the atmosphere is 10 mΩ or less under a load of 1N via an Ag probe.
(FR) [Problème] Fournir un matériau de barre conductrice qui maintient une faible résistance de contact dans un environnement à haute température et présente une excellente résistance à la chaleur, tout en ayant une résistance à l’insertion avantageusement faible. [Solution] La présente invention concerne un matériau de barre conductrice qui comprend séquentiellement une couche composée de Ni ou d’un alliage de Ni, une couche principalement composée de Cu, et une couche d’alliage composée de Cu et de Sn dans cet ordre sur un substrat conducteur composé de Cu ou d’un alliage de Cu, et qui est configuré de sorte que : l’épaisseur de la couche composée de Ni ou d’un alliage de Ni est de 0,1 à 2,0 µm ; l’épaisseur de la couche principalement composée de Cu est de 0,01 à 0,1 µm ; l’épaisseur de la couche d’alliage composée de Cu et de Sn est de 0,1 à 2,0 µm ; la rugosité de surface Ra est de 0,05 à 1,0 µm ; un oxyde de Cu et un oxyde de Sn sont contenus dans un film d’oxyde qui est formé sur la surface ; l’épaisseur du film d’oxyde est de 50 nm ou moins ; la proportion (%) de l’oxyde de Sn est de 90 % ou plus ; et la résistance de contact de ce matériau de barre après avoir été chauffé à la température de 140 °C pendant 120 heures dans l’atmosphère est de 10 mΩ ou moins sous une charge de 1 N par l’intermédiaire d’une sonde Ag.
(JA) 【課題】高温環境下で低接触抵抗を維持して耐熱性に優れ、かつ、低挿入性に優れる導電性条材を提供する。 【解決手段】CuまたはCu合金からなる導電性基材の上に、NiまたはNi合金からなる層、Cuを主成分とする層、CuおよびSnからなる合金層をこの順に有する導電性条材であって、前記NiまたはNi合金からなる層の厚さが0.1~2.0μm、前記Cuを主成分とする層の厚さが0.01~0.1μm、前記CuおよびSnからなる合金層の厚さが0.1~2.0μmであって、表面粗さRaが0.05~1.0μmであり、表面に形成される酸化物膜中にCuの酸化物およびSnの酸化物が含まれ、酸化物膜の厚さが50nm以下であり、Snの酸化物の割合(%)が90%以上であり、かつ、この導電性条材を温度140℃で120時間の条件で大気中において加熱した後の接触抵抗が、Agプローブを介した荷重1Nの条件下で10mΩ以下である、導電性条材。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)