Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2018074100) HIGH FREQUENCY BASE BODY, HIGH FREQUENCY PACKAGE, AND HIGH FREQUENCY MODULE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/074100 International Application No.: PCT/JP2017/032658
Publication Date: 26.04.2018 International Filing Date: 11.09.2017
IPC:
H01L 23/12 (2006.01) ,H01L 23/02 (2006.01) ,H01L 23/13 (2006.01) ,H05K 1/02 (2006.01) ,H05K 1/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
13
characterised by the shape
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
Applicants:
京セラ株式会社 KYOCERA CORPORATION [JP/JP]; 京都府京都市伏見区竹田鳥羽殿町6番地 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto 6128501, JP
Inventors:
川頭 芳規 KAWAZU, Yoshiki; JP
Priority Data:
2016-20667321.10.2016JP
Title (EN) HIGH FREQUENCY BASE BODY, HIGH FREQUENCY PACKAGE, AND HIGH FREQUENCY MODULE
(FR) CORPS DE BASE HAUTE FRÉQUENCE, BOÎTIER HAUTE FRÉQUENCE ET MODULE HAUTE FRÉQUENCE
(JA) 高周波基体、高周波パッケージおよび高周波モジュール
Abstract:
(EN) This high frequency base body is provided with an insulating base body, a first line conductor, and a second line conductor. The insulating base body has a recessed section in the upper surface. The first line conductor is positioned on the upper surface of the insulating base body. The second line conductor is positioned on the upper surface of the insulating base body, and extends in parallel to the first line conductor by being separated from the first line conductor in plan view. The recessed section is positioned between the first line conductor and the second line conductor, and has a dielectric constant that is lower than that of the insulating base body.
(FR) La présente invention concerne un corps de base haute fréquence pourvu d'un corps de base isolant, ainsi que de premier et second conducteurs de ligne. Le corps de base isolant possède une section en creux dans la surface supérieure. Le premier conducteur de ligne est positionné sur la surface supérieure du corps de base isolant. Le second conducteur de ligne est positionné sur la surface supérieure du corps de base isolant et s'étend parallèlement au premier conducteur de ligne tout en étant séparé de ce dernier, dans une vue en plan. La section en creux est positionnée entre les premier et second conducteurs de ligne, et présente une constante diélectrique inférieure à celle du corps de base isolant.
(JA) 本発明の高周波基体は、絶縁基体と、第1線路導体と、第2線路導体とを備えている。絶縁基体は、上面に凹部を有する。第1線路導体は、絶縁基体の上面に位置している。第2線路導体は、絶縁基体の上面に位置するとともに、平面視において第1線路導体と間が空いており第1線路導体と並行に延びている。凹部は、第1線路導体と第2線路導体との間に位置しているとともに、凹部は絶縁基体よりも誘電率が低い。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)