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|1. (WO2018066420) SEMICONDUCTOR DEVICE|
A semiconductor device is provided with: a first chip (10) including a first switching element (12) that limits a flow of electric current in one direction in a current path; a second chip (20) including a second switching element (22) that limits a flow of electric current in the opposite direction to the one direction in the current path; wiring (30) serving as a relay between the first chip and the second chip and thereby forming a part of the current path; a lead frame (40) which comprises a first lead (42) with the first chip fixedly arranged thereon and a second lead (44) with the second chip fixedly arranged thereon, and which forms a current path; and a mold resin (60) which integrally seals the first chip, the second chip, the wiring, and the lead frame. The wiring is a shunt resistance including a resistor (32). The lead frame further includes a sense terminal (100e, 100f, 46) for detecting a voltage drop across the resistor.