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1. (WO2018066420) SEMICONDUCTOR DEVICE

Pub. No.:    WO/2018/066420    International Application No.:    PCT/JP2017/034829
Publication Date: Fri Apr 13 01:59:59 CEST 2018 International Filing Date: Thu Sep 28 01:59:59 CEST 2017
IPC: H01L 25/07
H01L 23/48
H01L 25/18
Applicants: DENSO CORPORATION
株式会社デンソー
Inventors: HAYASHI Hiromasa
林 敬昌
TOMOTO Shunsuke
戸本 俊介
MORI Yusuke
森 勇輔
Title: SEMICONDUCTOR DEVICE
Abstract:
A semiconductor device is provided with: a first chip (10) including a first switching element (12) that limits a flow of electric current in one direction in a current path; a second chip (20) including a second switching element (22) that limits a flow of electric current in the opposite direction to the one direction in the current path; wiring (30) serving as a relay between the first chip and the second chip and thereby forming a part of the current path; a lead frame (40) which comprises a first lead (42) with the first chip fixedly arranged thereon and a second lead (44) with the second chip fixedly arranged thereon, and which forms a current path; and a mold resin (60) which integrally seals the first chip, the second chip, the wiring, and the lead frame. The wiring is a shunt resistance including a resistor (32). The lead frame further includes a sense terminal (100e, 100f, 46) for detecting a voltage drop across the resistor.