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1. (WO2018066416) COMPOSITE RESIN COMPOSITION, AND ELECTRONIC COMPONENT FORMED FROM SAID COMPOSITE RESIN COMPOSITION
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Pub. No.: WO/2018/066416 International Application No.: PCT/JP2017/034794
Publication Date: 12.04.2018 International Filing Date: 26.09.2017
IPC:
C08L 77/12 (2006.01) ,C08G 69/44 (2006.01) ,C08K 7/00 (2006.01) ,H01R 12/72 (2011.01) ,H01R 13/46 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77
Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
12
Polyester-amides
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
69
Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
44
Polyester-amides
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
7
Use of ingredients characterised by shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12
Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
70
Coupling devices
71
for rigid printing circuits or like structures
72
coupling with the edge of the rigid printed circuits or like structures
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
46
Bases; Cases
Applicants:
ポリプラスチックス株式会社 POLYPLASTICS CO., LTD. [JP/JP]; 東京都港区港南二丁目18番1号 2-18-1, Konan, Minato-ku, Tokyo 1088280, JP
Inventors:
深津 博樹 FUKATSU Hiroki; JP
瀧 智弘 TAKI Tomohiro; JP
Agent:
正林 真之 SHOBAYASHI Masayuki; JP
林 一好 HAYASHI Kazuyoshi; JP
Priority Data:
2016-19906107.10.2016JP
Title (EN) COMPOSITE RESIN COMPOSITION, AND ELECTRONIC COMPONENT FORMED FROM SAID COMPOSITE RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE COMPOSITE, ET COMPOSANT ÉLECTRONIQUE FABRIQUÉ À PARTIR DE LADITE COMPOSITION DE RÉSINE COMPOSITE
(JA) 複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品
Abstract:
(EN) A composite resin composition, from which it is possible to obtain an electronic component which has excellent heat resistance and in which warp deformation and blistering are suppressed, and an electronic component formed from said composite resin composition are provided. This composite resin composition contains (A) a liquid crystal polymer, (B) a fibrous filler, (C) a plate-form filler. As an essential constituent component, the liquid crystal polymer (A) contains a wholly aromatic polyester amide which comprises prescribed amounts of structural units (I) to (VI) and exhibits optical anisotropy during melting. The weight average fiber length of the fibrous filler (B) is greater than or equal to 250 μm.
(FR) La présente invention concerne une composition de résine composite, à partir de laquelle il est possible d'obtenir un composant électronique qui a une excellente résistance à la chaleur, une déformation de la chaîne et un cloquage étant supprimés. L'invention concerne également un composant électronique formé à partir de ladite composition de résine composite. Cette composition de résine composite contient (A) un polymère à cristaux liquides, (B) une charge fibreuse et (C) une charge lamellaire. En tant que composant constitutif essentiel, le polymère à cristaux liquides (A) contient un polyester amide entièrement aromatique qui comprend les quantités prescrites d'unités structurales (I) à (VI) et présente une anisotropie optique pendant la fusion. La longueur de fibre moyenne en poids de la charge fibreuse (B) est supérieure ou égale à 250 µm.
(JA) 耐熱性に優れ、そり変形及びブリスター発生が抑制された電子部品が得られる複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品を提供する。 本発明に係る複合樹脂組成物は、(A)液晶性ポリマーと、(B)繊維状充填剤と、(C)板状充填剤と、を含み、上記(A)液晶性ポリマーは、必須の構成成分として、所定量の下記構成単位(I)~(VI)からなる、溶融時に光学的異方性を示す全芳香族ポリエステルアミドであり、前記(B)繊維状充填剤の重量平均繊維長は、250μm以上である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)