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1. (WO2018066297) ELECTROLYTIC TREATMENT TOOL AND ELECTROLYTIC TREATMENT METHOD
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/066297    International Application No.:    PCT/JP2017/032321
Publication Date: 12.04.2018 International Filing Date: 07.09.2017
IPC:
C25D 17/12 (2006.01), C25D 5/00 (2006.01), C25D 7/12 (2006.01), C25D 17/06 (2006.01), C25D 21/04 (2006.01)
Applicants: TOKYO ELECTRON LIMITED [JP/JP]; 3-1, Akasaka 5-chome, Minato-ku, Tokyo 1076325 (JP)
Inventors: HOSHINO, Tomohisa; (JP).
HAMADA, Masato; (JP).
KANEKO, Satoshi; (JP).
YAMAGUCHI, Kiyomitsu; (JP)
Agent: KANEMOTO, Tetsuo; (JP).
KAMEYA, Yoshiaki; (JP).
HAGIWARA, Yasushi; (JP)
Priority Data:
2016-198728 07.10.2016 JP
Title (EN) ELECTROLYTIC TREATMENT TOOL AND ELECTROLYTIC TREATMENT METHOD
(FR) OUTIL DE TRAITEMENT ELECTROLYTIQUE ET PROCÉDÉ DE TRAITEMENT ELECTROLYTIQUE
(JA) 電解処理治具及び電解処理方法
Abstract: front page image
(EN)Disclosed is an electrolytic treatment tool that is used at the time of subjecting a substrate to be treated to an electrolytic treatment by using a treatment solution supplied to the substrate to be treated, the electrolytic treatment tool comprising: a flat-plate-shaped base body; and a direct electrode that is for applying a voltage between itself and the substrate to be treated while being in contact with the treatment solution, the direct electrode being provided on a surface of the base body. The surface of the electrolytic treatment tool on the side of the substrate to be treated has an uneven shape.
(FR)L'invention concerne un outil de traitement électrolytique qui est utilisé au moment de soumettre un substrat à traiter à un traitement électrolytique au moyen d'une solution de traitement fournie au substrat à traiter, l'outil de traitement électrolytique comprenant : un corps de base en forme de plaque plane ; et une électrode directe destinée à appliquer une tension entre elle-même et le substrat à traiter tout en étant en contact avec la solution de traitement, l'électrode directe étant disposée sur une surface du corps de base. La surface de l'outil de traitement électrolytique sur le côté du substrat à traiter présente une forme irrégulière.
(JA)被処理基板に供給された処理液を用いて、当該被処理基板に電解処理を行う際に利用する電解処理治具は、平板状の基体と、当該基体の表面に設けられて、処理液に接触して被処理基板との間で電圧を印加するための直接電極とを有しており、電解処理治具における被処理基板側の表面は凹凸形状を有している。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)