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1. (WO2018066247) ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD

Pub. No.:    WO/2018/066247    International Application No.:    PCT/JP2017/030173
Publication Date: Fri Apr 13 01:59:59 CEST 2018 International Filing Date: Thu Aug 24 01:59:59 CEST 2017
IPC: G03F 7/039
G03F 7/004
G03F 7/20
Applicants: FUJIFILM CORPORATION
富士フイルム株式会社
Inventors: MARUMO Kazuhiro
丸茂 和博
TANGO Naohiro
丹呉 直紘
Title: ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD
Abstract:
Provided are: an active light sensitive or radiation sensitive resin composition from which a resist film can be formed having excellent water repellency and having, after coming into contact with an alkali developing solution, improved hydrophilicity can be formed, and on which a pattern having an excellent LWR; a resist film; a pattern forming method; and an electronic device manufacturing method. This active light sensitive or radiation sensitive resin composition contains a resin A of which the solubility to an alkali developing solution is increased by an action of an acid, a compound B which generates an acid by being irradiated with active light or radiation, a resin C which has a surface energy exceeding 25 mJ/m2, which has at least fluorine atoms or silicon atoms, and which has a polarity conversion group, and a resin D which has a surface energy of 25 mJ/m2 or lower. The contained amount of the resin D is at least 1.1 mass% with respect to the total solid content of the active light sensitive or radiation sensitive resin composition.