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1. (WO2018066229) LASER DICING ASSISTANCE SHEET

Pub. No.:    WO/2018/066229    International Application No.:    PCT/JP2017/028991
Publication Date: Fri Apr 13 01:59:59 CEST 2018 International Filing Date: Thu Aug 10 01:59:59 CEST 2017
IPC: H01L 21/301
B23K 26/38
B23K 26/70
C09J 7/02
C09J 11/06
C09J 133/06
Applicants: KIMOTO CO., LTD.
株式会社きもと
Inventors: NOZAWA, Kazuhiro
野澤 和洋
Title: LASER DICING ASSISTANCE SHEET
Abstract:
Provided is a laser dicing assistance sheet with which chips can be prevented from coming loose during full-cut dicing by laser light irradiation can be prevented. The laser dicing assistance sheet comprises an adhesive layer formed from an adhesive composition. The adhesive layer is characterized by being adjusted such that the residual weight (as measured under a flow of nitrogen (50 ml/min) at a heating rate of 10°C/min) of the constituent material (adhesive composition) at 500°C is not more than 5.5%.