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1. (WO2018065369) 3D PRINTING METHOD AND PRODUCT
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Pub. No.: WO/2018/065369 International Application No.: PCT/EP2017/074990
Publication Date: 12.04.2018 International Filing Date: 02.10.2017
IPC:
B29C 67/00 (2017.01) ,B33Y 10/00 (2015.01) ,B33Y 80/00 (2015.01) ,B29C 64/118 (2017.01)
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
67
Shaping techniques not covered by groups B29C39/-B29C65/93
[IPC code unknown for B33Y 10][IPC code unknown for B33Y 80][IPC code unknown for B29C 64/118]
Applicants:
SIGNIFY HOLDING B.V. [NL/NL]; High Tech Campus 48 5656 AE Eindhoven, NL
Inventors:
HIKMET, Rifat, Ata, Mustafa; NL
VAN BOMMEL, Ties; NL
Agent:
VERWEIJ, Petronella, Danielle; NL
Priority Data:
16192224.004.10.2016EP
Title (EN) 3D PRINTING METHOD AND PRODUCT
(FR) PROCÉDÉ ET APPAREIL D'IMPRESSION 3D
Abstract:
(EN) A product and a method of manufacturing a product are provided, in which a 3D structure (26) is printed over a printed circuit board (20). An adhesion layer (24) is provided between them. One of the interfaces to the adhesion layer (24) comprises a cavity structure (22). This improves adhesion and releases stress build up in the printed circuit board (20).
(FR) L'invention concerne un produit et un procédé de fabrication d'un produit, une structure 3D (26) étant imprimée sur une carte de circuit imprimé (20). Une couche d'adhérence (24) est disposée entre elles. Une des interfaces à la couche d'adhérence (24) comprend une structure de cavité (22). Ceci améliore l'adhérence et libère l'accumulation de contrainte dans la carte de circuit imprimé (20). Fig. 2
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)