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1. (WO2018063865) APPARATUS AND METHODS FOR REDUCED-ARC SPUTTERING
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Pub. No.: WO/2018/063865 International Application No.: PCT/US2017/052365
Publication Date: 05.04.2018 International Filing Date: 20.09.2017
IPC:
H01J 37/34 (2006.01) ,H01L 21/687 (2006.01) ,H01J 37/32 (2006.01) ,C23C 14/35 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
J
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32
Gas-filled discharge tubes
34
operating with cathodic sputtering
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
687
using mechanical means, e.g. chucks, clamps or pinches
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
J
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32
Gas-filled discharge tubes
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
34
Sputtering
35
by application of a magnetic field, e.g. magnetron sputtering
Applicants:
CORNING INCORPORATED [US/US]; 1 Riverfront Plaza Corning, New York 14831, US
Inventors:
OUYANG, Xu; US
PAN, Yale G; US
Agent:
SCHMIDT, Jeffrey A; US
Priority Data:
62/400,23427.09.2016US
Title (EN) APPARATUS AND METHODS FOR REDUCED-ARC SPUTTERING
(FR) APPAREIL ET PROCÉDÉS DE PULVÉRISATION À ARC RÉDUIT
Abstract:
(EN) An apparatus designed to sputter a material onto a plurality of substrates includes a rotating metal frame, a plurality of carriers, and an insulator disposed between the metal frame and the plurality of carriers. The plurality of carriers are designed to hold one or more fixtures that secure the plurality of substrates, and each of the plurality of carriers is designed to couple to the metal frame. The insulator is disposed between the metal frame and the plurality of carriers at locations where the plurality of carriers are coupled to the metal frame such that the plurality of carriers are electrically isolated from the metal frame.
(FR) Un appareil conçu pour pulvériser un matériau sur une pluralité de substrats comprend un châssis métallique rotatif, une pluralité de supports, et un isolant disposé entre le châssis métallique et la pluralité de supports. La pluralité de supports sont conçus pour contenir un ou plusieurs dispositifs d'éclairage qui fixent la pluralité de substrats, et chaque support de la pluralité de supports est conçu pour se coupler au châssis métallique. L'isolant est disposé entre le châssis métallique et la pluralité de supports à des emplacements où la pluralité de supports sont couplés au châssis métallique de telle sorte que la pluralité de supports sont électriquement isolés du cadre métallique.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)