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1. (WO2018063851) MULTIPLE DIAMETER IN-VACUUM WAFER HANDLING
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Pub. No.: WO/2018/063851 International Application No.: PCT/US2017/052155
Publication Date: 05.04.2018 International Filing Date: 19.09.2017
IPC:
H01L 21/67 (2006.01) ,H01L 21/677 (2006.01) ,H01L 21/687 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
687
using mechanical means, e.g. chucks, clamps or pinches
Applicants:
AXCELIS TECHNOLOGIES, INC. [US/US]; ATTN: Denis A. Robitaille 108 Cherry Hill Drive Beverly, Massachusetts 01915, US
Inventors:
WEED, Allan; US
Priority Data:
15/281,60030.09.2016US
Title (EN) MULTIPLE DIAMETER IN-VACUUM WAFER HANDLING
(FR) MANIPULATION DE TRANCHE SOUS VIDE À DIAMÈTRE MULTIPLE
Abstract:
(EN) An electrostatic chuck and gripping system are configured for clamping and processing workpieces having differing diameters. An ion implantation apparatus selectively provides ions to a first workpiece and a second workpiece in a process chamber, where a diameter of the first workpiece is greater the second workpiece. A chuck supports the respective first or second workpiece within the process chamber during exposure to the ions. A load lock chamber isolates a process environment from an external environment and has a workpiece support for the respective first or second workpiece during a transfer of the first or second workpiece between the process chamber and the external environment. A vacuum robot transfers the first or second workpiece between the chuck and workpiece support, and has a gripper mechanism configured to selectively grip the first or second workpiece between a plurality of stepped guides.
(FR) Un mandrin électrostatique et un système de préhension sont configurés pour serrer et traiter des pièces à travailler ayant des diamètres différents. Un appareil d'implantation ionique fournit sélectivement des ions à une première pièce à travailler et à une seconde pièce à travailler dans une chambre de traitement,le diamètre de la première pièce à travailler étant supérieur à la seconde pièce à travailler. Un mandrin supporte la première ou la seconde pièce à travailler respective à l'intérieur de la chambre de traitement pendant l'exposition aux ions. Une chambre de verrouillage de charge isole un environnement de traitement d'un environnement externe et comporte un support de pièce à travailler pour la première ou la seconde pièce à travailler respective pendant un transfert de la première ou de la seconde pièce à travailler entre la chambre de traitement et l'environnement externe. Un robot sous vide transfère la première ou la seconde pièce à travailler entre le mandrin et le support de pièce à travailler, et a un mécanisme de préhension configuré pour saisir de manière sélective la première ou la seconde pièce à travailler entre une pluralité de guides étagés.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)