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1. (WO2018063624) A PACKAGE WITH THERMAL COUPLING

Pub. No.:    WO/2018/063624    International Application No.:    PCT/US2017/048704
Publication Date: Fri Apr 06 01:59:59 CEST 2018 International Filing Date: Sat Aug 26 01:59:59 CEST 2017
IPC: H01L 23/36
H01L 23/40
H01L 23/498
H01L 23/31
H01L 25/07
H01L 25/065
Applicants: INTEL CORPORATION
Inventors: KIM, Hyoung, Il
SHOJAIE, Saeed S.
Title: A PACKAGE WITH THERMAL COUPLING
Abstract:
Embodiments herein relate to thermal coupling using through mold vias (TMV). Embodiments may include a substrate having a first side and a second side opposite the first side, a processor having a first side and the second side, the first side of the processor coupled to the first side of the substrate, one or more solder balls where the first side of the one or more solder balls are thermally coupled to the second side of the processor and where the solder balls are embedded in one or more TMVs in a molding extending from a first side of the molding to a second side of the molding opposite the first side of the molding. Other embodiments may be described and/or claimed.