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1. WO2018063560 - WAVEGUIDE BUNDLE FABRICATION IN SUSPENDED MEDIA

Publication Number WO/2018/063560
Publication Date 05.04.2018
International Application No. PCT/US2017/047299
International Filing Date 17.08.2017
IPC
G02B 6/10 2006.1
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
10of the optical waveguide type
G06F 13/18 2006.1
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
13Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
14Handling requests for interconnection or transfer
16for access to memory bus
18with priority control
G02B 6/12 2006.1
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
10of the optical waveguide type
12of the integrated circuit kind
CPC
G02B 2006/12069
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
10of the optical waveguide type
12of the integrated circuit kind
12035Materials
12069Organic material
G02B 6/10
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
10of the optical waveguide type
G06F 1/182
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
18Packaging or power distribution
181Enclosures
182with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
G06F 13/18
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
13Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
14Handling requests for interconnection or transfer
16for access to memory bus
18based on priority control
H01P 11/006
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
11Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
001Manufacturing waveguides or transmission lines of the waveguide type
006Manufacturing dielectric waveguides
H01P 3/122
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3Waveguides; Transmission lines of the waveguide type
12Hollow waveguides
122Dielectric loaded (not air)
Applicants
  • INTEL CORPORATION [US]/[US]
Inventors
  • DOGIAMIS, Georgios C.
  • OSTER, Sasha N.
  • KAMGAING, Telesphor
  • ELSHERBINI, Adel A.
  • SWAN, Johanna M.
  • LIFF, Shawna M.
  • ALEKSOV, Aleksandar
  • RAWLINGS, Brandon M.
  • DISCHLER, Richard J.
Agents
  • PERDOK, Monique M.
  • BLACK, David W., Reg. No. 42,331
  • BEEKMAN, Marvin L., Reg. No. 38,377
  • ARORA, Suneel, Reg. No. 42,267
  • BIANCHI, Timothy E., Reg. No. 39,610
  • WOO, Justin N., Reg. No. 62,686
  • MCCRACKIN, Ann M., Reg. No. 42,858
  • GOULD, James R., Reg. No. 72,086
  • SCHEER, Bradley W., Reg. No. 47,059
Priority Data
15/282,08630.09.2016US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) WAVEGUIDE BUNDLE FABRICATION IN SUSPENDED MEDIA
(FR) FABRICATION DE FAISCEAU DE GUIDES D'ONDES DANS DES SUPPORTS SUSPENDUS
Abstract
(EN) An apparatus comprises a plurality of waveguides, wherein the waveguides include a dielectric material; an outer shell; and a supporting feature within the outer shell, wherein the waveguides are arranged separate from each other within the outer shell by the supporting feature.
(FR) Un appareil comprend une pluralité de guides d'ondes, les guides d'ondes comprenant un matériau diélectrique; une coque externe; et un élément de support à l'intérieur de la coque externe, les guides d'ondes étant agencés de manière séparée l'un de l'autre à l'intérieur de la coque externe par la caractéristique de support.
Latest bibliographic data on file with the International Bureau