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1. (WO2018063511) INTEGRATED CIRCUIT PACKAGE HAVING RECTANGULAR ASPECT RATIO

Pub. No.:    WO/2018/063511    International Application No.:    PCT/US2017/046016
Publication Date: Fri Apr 06 01:59:59 CEST 2018 International Filing Date: Thu Aug 10 01:59:59 CEST 2017
IPC: H01L 25/065
H01L 25/07
H01L 25/00
H01L 23/48
Applicants: INTEL CORPORATION
Inventors: KELLAR, Scot A
CREWS, Darren S
Title: INTEGRATED CIRCUIT PACKAGE HAVING RECTANGULAR ASPECT RATIO
Abstract:
An integrated circuit (IC) packaging arrangement for surface mounting of the IC includes a package body that encapsulates one or more IC dies. The package body according to some embodiments has rectangular aspect ratio with a length dimension and a width dimension of different size. The IC packaging according to some embodiments includes leadless surface-mount electrical contacts. According to some embodiments, the leadless surface-mount contacts are situated in clusters at opposite ends of the length dimension of the IC body.