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Machine translation
1. (WO2018063327) OVERPASS DICE STACKS AND METHODS OF USING SAME
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/063327    International Application No.:    PCT/US2016/054785
Publication Date: 05.04.2018 International Filing Date: 30.09.2016
IPC:
H01L 23/00 (2006.01), H01L 23/48 (2006.01), H01L 25/065 (2006.01)
Applicants: INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054 (US).
CHEAH, Bok Eng [MY/MY]; (MY).
LIM, Min Suet [MY/MY]; (MY).
KONG, Jackson Chung Peng [MY/MY]; (MY)
Inventors: CHEAH, Bok Eng; (MY).
LIM, Min Suet; (MY).
KONG, Jackson Chung Peng; (MY)
Agent: GOULD, James R.; (US).
ARORA, Suneel / U.S. Reg. No. 42,267; (US).
BEEKMAN, Marvin / U.S. Reg. No. 38,377; (US).
BLACK, David W. / U.S. Reg. No. 42,331; (US).
PERDOK, Monique M. / U.S. Reg. No. 42,989; (US).
SCHEER, Bradley W. / U.S. Reg. No. 47,059; (US).
WOO, Justin N. / U.S. Reg. No. 62,686; (US)
Priority Data:
Title (EN) OVERPASS DICE STACKS AND METHODS OF USING SAME
(FR) EMPILEMENTS DE PUCES EN PONT ET LEURS PROCÉDÉS D'UTILISATION
Abstract: front page image
(EN)A system in package device includes an overpass die on a package substrate and the overpass die includes a recess on the back side in order to straddle a landed die also on the package substrate. The recess is bounded by at least two overpass walls. Communication between the dice is done with a through-silicon via and communication between the overpass die and the package substrate is also done with a through-silicon via.
(FR)Dispositif de type système en boîtier comprenant une puce en pont sur un substrat de boîtier, la puce en pont comprenant un évidement sur le côté arrière afin de chevaucher une puce dotée pastilles, également montée sur le substrat de boîtier. L'évidement est délimité par au moins deux parois de pont. La communication entre les puces est réalisée par un via traversant et la communication entre la puce en pont et le substrat de boîtier est également réalisée par un via traversant.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)