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1. (WO2018063292) DATA STORAGE SYSTEM USING WAFER-LEVEL PACKAGING
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/063292    International Application No.:    PCT/US2016/054687
Publication Date: 05.04.2018 International Filing Date: 30.09.2016
IPC:
G11C 5/02 (2006.01), G11C 5/06 (2006.01), H01L 23/522 (2006.01)
Applicants: INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95054 (US)
Inventors: MEYERS, John G.; (US).
CRAFT, Leo J.; (US)
Agent: BRASK, Justin, K.; (US)
Priority Data:
Title (EN) DATA STORAGE SYSTEM USING WAFER-LEVEL PACKAGING
(FR) SYSTÈME DE STOCKAGE DE DONNÉES UTILISANT UNE ENCAPSULATION SUR TRANCHE
Abstract: front page image
(EN)A data storage system is described that uses wafer-level packaging. In one embodiment an apparatus includes a silicon wafer, a plurality of memory cells formed directly on the wafer, an encapsulant formed over the memory cells, a plurality of wiring connections to connect the memory cells to an external interface, a memory controller, and an external interface.
(FR)L'invention concerne un système de stockage de données qui utilise une encapsulation sur tranche. Selon un mode de réalisation, un appareil comprend une tranche de silicium, une pluralité de cellules de mémoire formées directement sur la tranche, un agent d'encapsulation formé sur les cellules de mémoire, une pluralité de liaisons câblées pour relier les cellules de mémoire à une interface externe, un contrôleur de mémoire et une interface externe.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)