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1. (WO2018062662) METHOD FOR MANUFACTURING AND PROCESSING ANTENNA CONTACT TERMINAL THIN FILM SHEET HAVING EXCELLENT BONDING PROPERTY WITH ALUMINUM AND ALUMINUM ALLOY
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.:    WO/2018/062662    International Application No.:    PCT/KR2017/006159
Publication Date: 05.04.2018 International Filing Date: 13.06.2017
IPC:
H01Q 1/38 (2006.01), H04M 1/02 (2006.01), H01B 1/02 (2006.01), H01B 5/14 (2006.01)
Applicants: JEONYOUNG ELECTROCHEMICAL CO., LTD. [KR/KR]; 90 Gangchon-ro, Danwon-gu Ansan-si Gyeonggi-do 15423 (KR)
Inventors: LEE, Eul-Kyu; (KR).
WOO, Sang-Soo; (KR).
HWANG, Kyu-Ho; (KR).
LEE, Ki-Young; (KR)
Agent: C&S PATENT AND LAW OFFICE; 7th Floor, Daelim Acrotel 13 Eonju-ro 30-gil Gangnam-gu Seoul 06292 (KR)
Priority Data:
10-2016-0126330 30.09.2016 KR
Title (EN) METHOD FOR MANUFACTURING AND PROCESSING ANTENNA CONTACT TERMINAL THIN FILM SHEET HAVING EXCELLENT BONDING PROPERTY WITH ALUMINUM AND ALUMINUM ALLOY
(FR) PROCÉDÉ DE FABRICATION ET DE TRAITEMENT D'UNE FEUILLE DE FILM MINCE DE BORNE DE CONTACT D'ANTENNE AYANT UNE EXCELLENTE PROPRIÉTÉ DE LIAISON AVEC DE L'ALUMINIUM ET UN ALLIAGE D'ALUMINIUM
(KO) 알루미늄 및 알루미늄 합금과의 접합특성이 우수한 안테나용 접촉 단자 박막 시트의 제조 및 처리방법
Abstract: front page image
(EN)The present invention relates to an antenna contact terminal thin film sheet and a manufacturing method therefor, the thin film sheet comprising: a first surface plating layer for satisfying corrosion resistance and wear resistance; and a second surface plating layer having an excellent bonding property, and provides: an antenna contact terminal thin film sheet having a copper foil and a tin plating layer made of tin or tin-containing alloy formed on one surface of the copper foil; and a method for manufacturing an antenna contact terminal thin film sheet, comprising: a nickel plating layer formation step forming a nickel plating layer on a first surface of the copper foil by means of electroplating; a gold plating layer formation step of forming a gold plating layer of gold or gold alloy on the nickel plating layer by means of electroplating; and a tin plating layer formation step of forming, by means of electroplating, a plating layer of tin or tin alloy on a second surface of the copper foil by using a plating solution containing tin.
(FR)La présente invention concerne une feuille de film mince de borne de contact d'antenne et son procédé de fabrication, la feuille de film mince comprenant: une première couche de placage de surface pour permettre une résistance à la corrosion et une résistance à l'usure; et une seconde couche de placage de surface ayant une excellente propriété de liaison, et fournit : une feuille de film mince de borne de contact d'antenne ayant une feuille de cuivre et une couche de placage d'étain constituée d'étain ou d'un alliage contenant de l'étain formé sur une surface de la feuille de cuivre; et un procédé de fabrication d'une feuille de film mince de borne de contact d'antenne, comprenant : une étape de formation de couche de placage de nickel formant une couche de placage de nickel sur une première surface de la feuille de cuivre au moyen d'une galvanoplastie; une étape de formation de couche de placage d'or consistant à former une couche de placage d'or ou d'alliage d'or sur la couche de placage de nickel au moyen d'une galvanoplastie; et une étape de formation de couche de placage d'étain consistant à former, au moyen d'une galvanoplastie, une couche de placage d'étain ou d'alliage d'étain sur une seconde surface de la feuille de cuivre à l'aide d'une solution de placage contenant de l'étain.
(KO)본 발명은 내식성과 내마모성을 만족시키는 제1면 도금층과 접합특성이 우수한 제2면 도금층을 가지는 안테나용 접촉 단자 박막 시트 및 그 제조 방법에 관한 것으로서, 동박 및 상기 동박의 일면에 주석 또는 주석 함유 합금으로 된 주석도금층이 형성된 안테나용 접촉 단자 박막 시트를 제공하며, 또한, 동박의 제1면에 전해도금에 의해 니켈 도금층을 형성하는 니켈도금층 형성 단계, 상기 니켈 도금층 상에 전해도금에 의해 금 또는 금 합금의 금도금층을 형성하는 금도금층 형성 단계 및 상기 동박의 제2면에 전해도금에 의해 주석을 포함하는 도금액을 사용하여 주석 또는 주석 합금의 도금층을 형성하는 주석도금층 형성 단계를 포함하는 안테나용 접촉 단자 박막 시트 제조방법을 제공한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)